ASEMEP National Technical Symposium - Technical Paper
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2022
Academe
- AQMoD An IoT Implementation of Air Monitoring, Mapping , and Warning System Using Drone Technology.pdf
- BIKESECURE - An IoT - Based Bicycle Security System With Image Capturing and Location Tracking.pdf
- Cashless and Contactless Fare Payment System for Public Utility Vehicle.pdf
- Ground Fissue Detection System Using Raspberry PI and Drone Technology.pdf
- Low-Cost Solar-Powered Hydroponics Water Quality Automation System.pdf
- Microcontroller-Based Automated Disinfection Machine With Attendance and Temperature Monitoring System.pdf
- Real-Time Facemasks Detection With Temperature Checking System.pdf
- Smart Hard Hat With Emergency Alert and Tracking System Using Arduino.pdf
- Solar-Powered Greenhouse System for Lettuce Using Arduino.pdf
Assembly Manufacturing
- A Capacity Up Improvement in Printed Circuit Board Assembly (PCBA) Removal Thru Total Productive Industrial Engineering (TPIE) Approach.pdf
- Automated Dispense Nozzle Cleaning Machine - TI Inside.pdf
- Bond Pad Crack Elimination on Power Semiconductor Devices With Sensitive Bond Pad Structure.pdf
- Design and Application of a CMOS Imager Based Barcode Recognition System in Enterprise SSD Traceability System.pdf
- Efficient and Low-Cost High Speed Electrolytic Belt Stripping Chemical Solution.pdf
- Error Proofing Detection of Wire Entanglement During Wirebonding - Stop the Risk on WRWR Resolution.pdf
- Increasing Overall Tool Availability - Costless Investment Through Wafer Sourcing and Recycling.pdf
- Influence of Blade Usage in the Occurrence of SN Metal Burrsduring Full Cut Singulation of Wettable Flank QFN Package.pdf
- Optimization of Laser Marking Parameters for Wettable Flank QFN Package Through Response Surface Methodology.pdf
- Package Integrity Improvement for Dual Pad Clip Bond Packages.pdf
- Plating Thickness SPC CPK Improvement - A New Way to Strategize SPC.pdf
- Reduction in Wafer Residual Resist Thru Effective Wafer Spin Speed Augmentation.pdf
Failure Analysis and Reliability
- ADVANCING FAILURE ANALYSIS THROUGH AUTO-DEFECT IMAGING FOR BIG DATA ANALYTICS.pdf
- Die Crack Resolution Using Fractography and Mechanical Stress Simulation.pdf
- DIE CRACK SIMULATION - UNDERSTANDING DIE WEAKNESS IN THE PRESENCE OF DIE ATTACH SOLDER VOIDIN CLIP BOND DEVICES.pdf
- FASTER SETUP TIME USING THE CONVERTER BENCH SYSTEM USING LABVIEW AND NI-6363.pdf
- Fault Localization of Temperature-Dependent Digital Circuit Functional Failures Utilizing the Scan-based Bench Testing and the DALS .pdf
- NON-DESTRUCTIVE PACKAGE-LEVEL FAULT LOCALIZATION IN CHIP SCALE PACKAGE BALL GRID ARRAY (CSP-BGA) DEVICES.pdf
- PHYSICAL FAILURE ANALYSIS OF HDCP-RELATED FAILURE INAHIGH SPEED SERDES.pdf
- REDEFINED IMC COVERAGE METHODOLOGY FOR PCC-CU WIRES BONDED TO ALUMINUM PAD.pdf
- SELECTIVE BACKSIDE DECAPSULATION ON MULTIPLE PADDLED DEVICES WITH DOWNBONDS1.pdf
- UTILIZATION OF ELITE SYSTEM FOR PRECISE FAULT LOCALIZATION OF FUNCTIONAL FAILING INTEGRATED CIRCUIT (IC).pdf
Product
- HALF-BRIDGE SILICON CARBIDE POWER MODULE STRAY INDUCTANCE EXTRACTION USING LOW VOLTAGE –LOW CURRENT TEST METHOD.pdf
- HOW TO ACHIEVE A QUALITY LEVEL 3 IBIS MODEL THROUGH BENCH MEASUREMENT.pdf
- PLASMA OPTIMIZATION FOR SILVER-PLATED COPPER LEADFRAMES.pdf
- THERMAL EXPANSION SIMULATION OF SINGULATED MOLDED SUBSTRATE THROUGH FINITE ELEMENT ANALYSIS.pdf
Quality System
- ELIMINATION OF DISTURBED WIREIN SOIC8 & SOIC16 PACKAGES.pdf
- EMPOWERING LEAN PRINCIPLES IN AUTOMOTIVE MANUFACTURING INDUSTRY - ADDRESSING THE CHALLENGES AND CAPTURING BEST PRACTICES.pdf
- HANDS-FREE TURNSTILE
- IMPROVEMENT OF LOW LEVEL EPOXY SENSING AND ELIMINATION OF HUMAN INTRUSION.pdf
- LASER CUTTING MACHINE IMPROVEMENT AND DEFECT REDUCTION THROUGH VACUUM OPTIMIZATION.pdf
- MACHINE QUALIFICATION - SETTING A NEW STANDARD.pdf
- MANAGING SCRAP - A BENCHMARK APPROACH.pdf
- REDUCTION OF QC FAILURES RELATED TOELECTRICALLY-INDUCED PHYSICAL DAMAGE.pdf
- SURFACE CONTAMINATION REDUCTION ON CLEAN BOOTH AREA.pdf
- The Flash Back - Resolving Customer Power Pad Mounting Issues through Flash Prevention and Enabling Auto Back Side Inspection.pdf
Support System
- 31st ANTS_PROCESS CONTROL AND CERTIFICATION_REDEFINING ORDINARY TO EXTRAORDINARY SOLUTIONS.pdf
- 31st ANTS_TOWARDS THE FUTURE OF DATA SCIENCE RESTRUCTURING THE UNSTRUCTURED LEGACY SOLUTIONS.pdf
- DIGITAL PRESSURE GAUGE READING USING TRANSFER LEARNING.pdf
- INNOVATIONOF ENERGY METERS THROUGHACCURATE MONITORINGON ENERGY CONSUMPTIONOF END-USER TO CREATE ENERGY EFFICIENCY AND CONSERVATION PROGRAMS.pdf
- Uninterruptible Supply of Compressed Dry Air using Liquid Nitrogen.pdf
Test Manufacturing
- A SIMPLE METHOD FOF CATCHING INTERMITTENT FAILURES.pdf
- AUTOMATED WAFER MAP CREATION FROM FINAL TEST DATA AND PATTERN CLASSIFICATION USING MACHINE LEARNING.pdf
- DEMYSTIFIED THROUGH PATTERNS - PROBLEM-SOLVING USING DATA ANALYSIS, DETECTION, PREDICTION, & PREVENTION.pdf
- ELIMINATION OF TEST ESCAPE ISSUES ON TEST HANDLER.pdf
- ENTANGLED UNITS’ PREVENTION - RASCO SIP TEST HANDLER HOPPER DESIGN .pdf
- EOS PREVENTION ADVOCACY - IN LINE TEST METHOD FOR CAPTURING DEFECTIVE BYPASS CAPACITORS IN TEST PERFORMANCE BOARDS THROUGH AN AUTOMATED TEST EQUIPMENT.pdf
- FINDING THESWEET SPOT - A DEEP-DIVE ANALYSIS ON NON-GENUINELOAD BOARD CHECK FAILS.pdf
- GREEN LASER - THE BREAKTHROUGH BRANDING TECHNOLOGY FOR 5G PRODUCTS.pdf
- INTELLIGENT THERMAL CONTROL & SOAK TIME REDUCTION, A SOLUTION TO IMPROVE CAPACITY AND UTILIZATION.pdf
- LIFTED LEADS ELIMINATION AT FINAL TEST USING RELIABILITYCENTEREDMAINTENANCE METHODOLOGY.pdf
- MACHINE LEARNING - FEATURE SELECTION FROM HIGH DIMENSIONAL DATA FOR EARLY DETECTION OF FAILURES ON SEMICONDUCTOR DEVICES.pdf
- MYSTERY UNLOCKED, DIAPHRAGM PRESSURE - THE KEY TO RESOLVE CONTACT SENSITIVITY.pdf
- PCB design board simulation Discovery - Eradicating Unwanted Voltage through Efficient Filter Lay-out.pdf
- RF Noise Reduction thru Test Signal Averaging.pdf
- Validation of Pressure Sensitive Adhesive asAlternative Accelerometer Attachment on Aluminum Alloy Jig under Vibration Test.pdf
- VALIDATION TO VERIFICATION(V2V) - AN ULTRAFLEX TOTEST VECTOR TRANSLATOR
2023
Assembly Manufacturing
- Adapting Lean & Advance Manufacturing Technology at OSS INS Assembly Line_FINAL.pdf
- ADAS_MULTI-FUNCTION_LIDAR_SCRAP_ELIMINATION.pdf
- AUGMENTING CAPABILITY OF BOTTLENECK PROCESS AT CCU BACK-END ASSEMBLY.pdf
- BRIDGE PICK TOOL MODIFICATION ON DACA MACHINES FOR TILTED CLIP AND CRACK DIE REJECT REDUCTION.pdf
- DEVELOPMENT AND CHALLENGES OF HIGH FEED SPEED.pdf
- ELEVATING PROCESS CONTROL AND CERTIFICATION UTILIZING ALID.pdf
- Eliminating Inductive Kickback by Using Diode as Surge Suppressor for BSAVI Machines.pdf
- Eliminating Short Circuit on Plc Signals Through the Use of Wire Jumper for FAVI Machines.pdf
- Embracing Evolution Photoresist Stripping 2.0.pdf
- Excessive Flashing Reduction on Plad Single-Die Bi-rectional Devices Thru Stack Height Analysis.pdf
- FORGING THE FOUNDATION OF LIGHTS OUT STRATEGY FOR INSPECTION BY SUSTAINING PACKAGE EXCELLENCE THROUGH SMARTT SAMPLING.pdf
- IMPACT OF LOW TEMPERATURE MOLD CLEANER CONDITIONER ON MOLD PROCESS.pdf
- JLP CABLE ASSEMBLY AND HARNESS CYCLE TIME REDUCTION THROUGH AUTOMATIC CONTINUITY TESTING.pdf
- LINE BALANCING IN SAS LINE 6 THROUGH CYCLE TIME OPTIMIZATION.pdf
- PD• 6NH3• 2RX NEW PALLADIUM ELECTROLYTE FORMULATION ENABLING THINNER METAL OPTIMUM DEPOSITION.pdf
- PNP Head Matrix II Asynchronous Pick Body Stroke; Causes, Effects, and Solutions.pdf
- Prevention of Servomotor Burn By Replacing Motor With Higher Torque.pdf
- REDUCING ELECTRICAL TEST OUTLIERS THROUGH SILVER SINTERING DIE ATTACH METHOD OPTIMIZATION.pdf
- REDUCTION OF CRUMPLED STRIPS OCCURRENCE FOR SOHED AT MECO-01.pdf
- REDUCTION OF LOW VACUUM PRESSURE READING ON VACUUM PROCESSOR.pdf
- REDUCTION OF PROCESS CYCLE TIME THROUGH THE INNOVATION OF MANUAL OR SEMI-AUTO JIGS & FIXTURES D.I.A.D.O.I. BASED APPROACH.pdf
- SAWING PROCESS STREAMLINING BY FULL CUT INTRODUCTION ON ULTRA THIN WAFERS.pdf
- SEMI-AUTOMATIC CRIMPING MACHINE SET-UP CYCLE TIME IMPROVEMENT THROUGH STANDARDIZATION OF PARAMETER SELECTION AND KITTING PROCESS.pdf
- SOT227 PRE-FORM FINAL FORM POKA-YOKE FOR TOOL PARTS BREAKAGE.pdf
- SURFACE IONIZATION EFFECT OF MIXED GAS Ar+H2 PLASMA.pdf
- SUSTAINABLE DEVELOPMENT A GUIDE TO PLATING COST EFFICIENCY.pdf
- ULTRA SHORT PULSE (USP) LASER GROOVING A NEW SAWING TECHNIQUE TO ADDRESS DIE STRENGTH ISSUES IN THINNER PACKAGES.pdf
- WAFER SAW PROCESS IMPROVEMENT THROUGH LASER GROOVE KERF CHECK OPTIMIZATION.pdf
- WIRELESS DETECTION OF ELECTROSTATIC DISCHARGE (ESD) EVENT THROUGH.pdf
Failure Analysis and Reliability
- Conductive Die Attach Delamnination on C19210.pdf
- DELAMINATION ANALYSIS OF AN ALN (DIRECT BOND COPPER SUBSTRATE) USING FINITE ELEMENT ANALYSIS (FEA) - BA, BM, CVC.pdf
- Elimination of Peel Off UV Adhesive on UV Shoulder.pdf
- Fractographic Analysis of Die Crack Simulated Under Different Fracturing Conditions.pdf
- HIGHLY ACCELERATED LIFE TEST AND ENVIRONMENTAL-3 ORT OPTIMIZATION_GSumalinog.pdf
- Impact of Die Attach Film Elastic Modulus on Adhesion and Package Reliability.pdf
- OUTRIGHT DETECTION OF DR TO DIA ASSY LEVEL RELIABILITY FAILURES_DPatarata.pdf
- Risk of Bulk Containers for ESD Sensitive Devices.pdf
- Validation of Pressure Sensitive Adhesive Naredo-Ebero-Diwa.pdf
Product
- ADDRESSING CRITICAL WIREBOND LOOP CHALLENGES ON AUTOMOTIVE MEMS DEVICE WITH STACKED-DICE CONFIGURATION.pdf
- Adhesion Enhancement via Surface Mechanical Treatment On ACP.pdf
- Control and Simulation of electrolytic migration_fullpaper.pdf
- Deep-Dive Investigation on Pad Discoloration Issue in Optical Sensing Device.pdf
- Introduction of Descaling for the Improvement of Half Cut Singulation Process of Wettable Flank QFN Packages.pdf
- Optimal Design of SiC MOSFET Half Bridge Power Module for 200A Current Rating based on Electrothermal Simulation.pdf
- Solder-induced HAST Failures.pdf
Quality System
- CACB RASCO JUPITER 2 COMMITTED MANUFACTURING CAPACITY (CMC) INSERTION IMPROVEMENT.pdf
- CHALLENGING THE PROCESS AND MATERIAL CHARACTERISTIC TO ADDRESS THE HIGH EPOXY USAGE CONSUMPTION OF VI POWER PACKAGES.pdf
- COMPARATIVE STUDY OF TWO SCANNING TECHNIQUES IN AUTOMATIC SIDE VISUAL INSPECTION OF WETTABLE FLANK QFN PACKAGES.pdf
- Device “T” Electrical Yield Improvement.pdf
- DEVISING VARIATION REDUCTION TECHNIQUES FROM STATISTICAL PROCESS CONTROL (SPC) SIGNALS TO ACHIEVE WIREBOND PROCESS STABILITY.pdf
- ELIMINATION OF BROKEN WIRE AT HEEL FOR SSOP PACKAGE.pdf
- ELIMINATION OF CONDUCTIVE DIE ATTACH FILM INTERFACIAL DELAMINATION DUE TO INTRINSIC HIGH ASPECT RATIO ULTRATHIN HIGH DIE BOW LEVEL.pdf
- Elimination of Mixed Device_onsemi Car_Eugenio.pdf
- Elimination of PCBA Related Functional Defects on Amber or Opal Machine by Improving M03-A13-00 Jadeback Connector Assembly using Sold.pdf
- ELIMINATION OF RBFA DISTURBED WIRE OCCURRENCE.pdf
- FT Guardband A Structural Solution Control in Screening Lots for Test.pdf
- IMPROVED MOLD TOOL DESIGN ROBUSTNESS THROUGH THE DMAIC PROCESS (Nexperia_WPena)
- LEADTIME IMPROVEMENT – BALANCED ARMATURE AGING REDUCTION_MPTorralba.pdf
- NETWORK SYSTEMS SOLUTIONS INTEGRATION TO ELIMINATE MISSING OR INCOMPLETE SUPPLIER KEY DATA USED FOR COMPONENT TRACEABILITY.pdf
- OVER REJECTION DOWNTIME REDUCTION THROUGH MAGNETIZED CLEANING BRUSH.pdf
- Reduction of 3rd Opt Yield Off and Fallen Units_Technical Paper Template.pdf
- REDUCTION OF DENTS THROUGH INSTALLATION OF EJECTOR PINS ON COMPOUND DIE.pdf
- Reduction of DIGHSB Board Failure on Device “S”.pdf
- Reduction of Module 2 Detape Rate.pdf
- REDUCTION OF OVER REJECTION AT 5 SIDES VISION OF TEST & TAPE MACHINES.pdf
- REDUCTION OF STRAY WIRE RBFA INCIDENT AT WIRE BOND.pdf
- TESTING PROCESS ROBUSTNESS ELIMINATION OF POTENTIAL MIXING CUSTOMER COMPLAIN THROUGH ERROR PROOFING METHODOLOGY.pdf
- Three_Way_Test_Detection_Enhancement_Paper.pdf
- VALUE STREAM MAPPING (VSM) ON MAP AVAILABILITY AT INCOMING QUALITY CONTROL (IQC) PHASE A LEAN APPROACH TO LEAD TIME REDUCTION AND MANUFACTURING EFFICIENCY IMPROVEMENT.pdf
Support System
- AUTOMOLD CELL CONTROLLER AUTOMATION OF MOLD MACHINES TO REDUCE QUALITY ISSUES.pdf
- DATA ANALYTICS THROUGH FAILURE CODE TRIGGER AND MULTI-LEVEL SCORECARD.pdf
- Elimination of External and Internal Findings_onsemi Car_Gabriel.pdf
- IMPROVEMENT OF PRODUCT RELEASE CHANGE ORDER (PRCO) PROCESS THROUGH PIMES SYSTEM INTEGRATION AND DIGITIZATION.pdf
- REUSING OF REVERSE OSMOSIS (RO) REJECT WATER THROUGH CREATION OF WATER HARVESTING SYSTEM TO CONSERVE WATER