Academe

• AQMoD An IoT Implementation of Air Monitoring, Mapping , and Warning System Using Drone Technology.pdf
• BIKESECURE - An IoT - Based Bicycle Security System With Image Capturing and Location Tracking.pdf
• Cashless and Contactless Fare Payment System for Public Utility Vehicle.pdf
• Ground Fissue Detection System Using Raspberry PI and Drone Technology.pdf
• Low-Cost Solar-Powered Hydroponics Water Quality Automation System.pdf
• Microcontroller-Based Automated Disinfection Machine With Attendance and Temperature Monitoring System.pdf
• Real-Time Facemasks Detection With Temperature Checking System.pdf
• Smart Hard Hat With Emergency Alert and Tracking System Using Arduino.pdf
• Solar-Powered Greenhouse System for Lettuce Using Arduino.pdf

Assembly Manufacturing

• A Capacity Up Improvement in Printed Circuit Board Assembly (PCBA) Removal Thru Total Productive Industrial Engineering (TPIE) Approach.pdf
• Automated Dispense Nozzle Cleaning Machine - TI Inside.pdf
• Bond Pad Crack Elimination on Power Semiconductor Devices With Sensitive Bond Pad Structure.pdf
• Design and Application of a CMOS Imager Based Barcode Recognition System in Enterprise SSD Traceability System.pdf
• Efficient and Low-Cost High Speed Electrolytic Belt Stripping Chemical Solution.pdf
• Error Proofing Detection of Wire Entanglement During Wirebonding - Stop the Risk on WRWR Resolution.pdf
• Increasing Overall Tool Availability - Costless Investment Through Wafer Sourcing and Recycling.pdf
• Influence of Blade Usage in the Occurrence of SN Metal Burrsduring Full Cut Singulation of Wettable Flank QFN Package.pdf
• Optimization of Laser Marking Parameters for Wettable Flank QFN Package Through Response Surface Methodology.pdf
• Package Integrity Improvement for Dual Pad Clip Bond Packages.pdf
• Plating Thickness SPC CPK Improvement - A New Way to Strategize SPC.pdf
• Reduction in Wafer Residual Resist Thru Effective Wafer Spin Speed Augmentation.pdf

Failure Analysis and Reliability

• ADVANCING FAILURE ANALYSIS THROUGH AUTO-DEFECT IMAGING FOR BIG DATA ANALYTICS.pdf
• Die Crack Resolution Using Fractography and Mechanical Stress Simulation.pdf
• DIE CRACK SIMULATION - UNDERSTANDING DIE WEAKNESS IN THE PRESENCE OF DIE ATTACH SOLDER VOIDIN CLIP BOND DEVICES.pdf
• FASTER SETUP TIME USING THE CONVERTER BENCH SYSTEM USING LABVIEW AND NI-6363.pdf
• Fault Localization of Temperature-Dependent Digital Circuit Functional Failures Utilizing the Scan-based Bench Testing and the DALS .pdf
• NON-DESTRUCTIVE PACKAGE-LEVEL FAULT LOCALIZATION IN CHIP SCALE PACKAGE BALL GRID ARRAY (CSP-BGA) DEVICES.pdf
• PHYSICAL FAILURE ANALYSIS OF HDCP-RELATED FAILURE INAHIGH SPEED SERDES.pdf
• REDEFINED IMC COVERAGE METHODOLOGY FOR PCC-CU WIRES BONDED TO ALUMINUM PAD.pdf
• SELECTIVE BACKSIDE DECAPSULATION ON MULTIPLE PADDLED DEVICES WITH DOWNBONDS1.pdf
• UTILIZATION OF ELITE SYSTEM FOR PRECISE FAULT LOCALIZATION OF FUNCTIONAL FAILING INTEGRATED CIRCUIT (IC).pdf

Product

• HALF-BRIDGE SILICON CARBIDE POWER MODULE STRAY INDUCTANCE EXTRACTION USING LOW VOLTAGE –LOW CURRENT TEST METHOD.pdf
• HOW TO ACHIEVE A QUALITY LEVEL 3 IBIS MODEL THROUGH BENCH MEASUREMENT.pdf
• PLASMA OPTIMIZATION FOR SILVER-PLATED COPPER LEADFRAMES.pdf
• THERMAL EXPANSION SIMULATION OF SINGULATED MOLDED SUBSTRATE THROUGH FINITE ELEMENT ANALYSIS.pdf

Quality System

• ELIMINATION OF DISTURBED WIREIN SOIC8 & SOIC16 PACKAGES.pdf
• EMPOWERING LEAN PRINCIPLES IN AUTOMOTIVE MANUFACTURING INDUSTRY - ADDRESSING THE CHALLENGES AND CAPTURING BEST PRACTICES.pdf
• HANDS-FREE TURNSTILE
• IMPROVEMENT OF LOW LEVEL EPOXY SENSING AND ELIMINATION OF HUMAN INTRUSION.pdf
• LASER CUTTING MACHINE IMPROVEMENT AND DEFECT REDUCTION THROUGH VACUUM OPTIMIZATION.pdf
• MACHINE QUALIFICATION - SETTING A NEW STANDARD.pdf
• MANAGING SCRAP - A BENCHMARK APPROACH.pdf
• REDUCTION OF QC FAILURES RELATED TOELECTRICALLY-INDUCED PHYSICAL DAMAGE.pdf
• SURFACE CONTAMINATION REDUCTION ON CLEAN BOOTH AREA.pdf
• The Flash Back - Resolving Customer Power Pad Mounting Issues through Flash Prevention and Enabling Auto Back Side Inspection.pdf

Support System

• 31st ANTS_PROCESS CONTROL AND CERTIFICATION_REDEFINING ORDINARY TO EXTRAORDINARY SOLUTIONS.pdf
• 31st ANTS_TOWARDS THE FUTURE OF DATA SCIENCE RESTRUCTURING THE UNSTRUCTURED LEGACY SOLUTIONS.pdf
• DIGITAL PRESSURE GAUGE READING USING TRANSFER LEARNING.pdf
• INNOVATIONOF ENERGY METERS THROUGHACCURATE MONITORINGON ENERGY CONSUMPTIONOF END-USER TO CREATE ENERGY EFFICIENCY AND CONSERVATION PROGRAMS.pdf
• Uninterruptible Supply of Compressed Dry Air using Liquid Nitrogen.pdf

Test Manufacturing

• A SIMPLE METHOD FOF CATCHING INTERMITTENT FAILURES.pdf
• AUTOMATED WAFER MAP CREATION FROM FINAL TEST DATA AND PATTERN CLASSIFICATION USING MACHINE LEARNING.pdf
• DEMYSTIFIED THROUGH PATTERNS - PROBLEM-SOLVING USING DATA ANALYSIS, DETECTION, PREDICTION, & PREVENTION.pdf
• ELIMINATION OF TEST ESCAPE ISSUES ON TEST HANDLER.pdf
• ENTANGLED UNITS’ PREVENTION - RASCO SIP TEST HANDLER HOPPER DESIGN .pdf
• EOS PREVENTION ADVOCACY - IN LINE TEST METHOD FOR CAPTURING DEFECTIVE BYPASS CAPACITORS IN TEST PERFORMANCE BOARDS THROUGH AN AUTOMATED TEST EQUIPMENT.pdf
• FINDING THESWEET SPOT - A DEEP-DIVE ANALYSIS ON NON-GENUINELOAD BOARD CHECK FAILS.pdf
• GREEN LASER - THE BREAKTHROUGH BRANDING TECHNOLOGY FOR 5G PRODUCTS.pdf
• INTELLIGENT THERMAL CONTROL & SOAK TIME REDUCTION, A SOLUTION TO IMPROVE CAPACITY AND UTILIZATION.pdf
• LIFTED LEADS ELIMINATION AT FINAL TEST USING RELIABILITYCENTEREDMAINTENANCE METHODOLOGY.pdf
• MACHINE LEARNING - FEATURE SELECTION FROM HIGH DIMENSIONAL DATA FOR EARLY DETECTION OF FAILURES ON SEMICONDUCTOR DEVICES.pdf
• MYSTERY UNLOCKED, DIAPHRAGM PRESSURE - THE KEY TO RESOLVE CONTACT SENSITIVITY.pdf
• PCB design board simulation Discovery - Eradicating Unwanted Voltage through Efficient Filter Lay-out.pdf
• RF Noise Reduction thru Test Signal Averaging.pdf
• Validation of Pressure Sensitive Adhesive asAlternative Accelerometer Attachment on Aluminum Alloy Jig under Vibration Test.pdf
• VALIDATION TO VERIFICATION(V2V) - AN ULTRAFLEX TOTEST VECTOR TRANSLATOR