ASEMEP National Technical Symposium - Technical Paper
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2022
Academe
Best Overall Academe Paper – First Asia Institute of Technology and Humanities (FAITH)
GROUND FISSUE DETECTION SYSTEM USING RASPBERRY PI AND DRONE TECHNOLOGY
- AQMoD An IoT Implementation of Air Monitoring, Mapping , and Warning System Using Drone Technology.pdf
- BIKESECURE - An IoT - Based Bicycle Security System With Image Capturing and Location Tracking.pdf
- Cashless and Contactless Fare Payment System for Public Utility Vehicle.pdf
- Low-Cost Solar-Powered Hydroponics Water Quality Automation System.pdf
- Microcontroller-Based Automated Disinfection Machine With Attendance and Temperature Monitoring System.pdf
- Real-Time Facemasks Detection With Temperature Checking System.pdf
- Smart Hard Hat With Emergency Alert and Tracking System Using Arduino.pdf
- Solar-Powered Greenhouse System for Lettuce Using Arduino.pdf
Assembly Manufacturing
Best Paper Track for Assembly Manufacturing – Texas Instruments Philippines Incorporated-Baguio
- A Capacity Up Improvement in Printed Circuit Board Assembly (PCBA) Removal Thru Total Productive Industrial Engineering (TPIE) Approach.pdf
- Bond Pad Crack Elimination on Power Semiconductor Devices With Sensitive Bond Pad Structure.pdf
- Design and Application of a CMOS Imager Based Barcode Recognition System in Enterprise SSD Traceability System.pdf
- Efficient and Low-Cost High Speed Electrolytic Belt Stripping Chemical Solution.pdf
- Error Proofing Detection of Wire Entanglement During Wirebonding - Stop the Risk on WRWR Resolution.pdf
- Increasing Overall Tool Availability - Costless Investment Through Wafer Sourcing and Recycling.pdf
- Influence of Blade Usage in the Occurrence of SN Metal Burrsduring Full Cut Singulation of Wettable Flank QFN Package.pdf
- Optimization of Laser Marking Parameters for Wettable Flank QFN Package Through Response Surface Methodology.pdf
- Package Integrity Improvement for Dual Pad Clip Bond Packages.pdf
- Plating Thickness SPC CPK Improvement - A New Way to Strategize SPC.pdf
- Reduction in Wafer Residual Resist Thru Effective Wafer Spin Speed Augmentation.pdf
Failure Analysis and Reliability
Best Paper Track for Failure Analysis and Reliability – Analog Devices, Inc.
- ADVANCING FAILURE ANALYSIS THROUGH AUTO-DEFECT IMAGING FOR BIG DATA ANALYTICS.pdf
- Die Crack Resolution Using Fractography and Mechanical Stress Simulation.pdf
- DIE CRACK SIMULATION - UNDERSTANDING DIE WEAKNESS IN THE PRESENCE OF DIE ATTACH SOLDER VOIDIN CLIP BOND DEVICES.pdf
- FASTER SETUP TIME USING THE CONVERTER BENCH SYSTEM USING LABVIEW AND NI-6363.pdf
- Fault Localization of Temperature-Dependent Digital Circuit Functional Failures Utilizing the Scan-based Bench Testing and the DALS .pdf
- NON-DESTRUCTIVE PACKAGE-LEVEL FAULT LOCALIZATION IN CHIP SCALE PACKAGE BALL GRID ARRAY (CSP-BGA) DEVICES.pdf
- PHYSICAL FAILURE ANALYSIS OF HDCP-RELATED FAILURE INAHIGH SPEED SERDES.pdf
- REDEFINED IMC COVERAGE METHODOLOGY FOR PCC-CU WIRES BONDED TO ALUMINUM PAD.pdf
- SELECTIVE BACKSIDE DECAPSULATION ON MULTIPLE PADDLED DEVICES WITH DOWNBONDS1.pdf
- UTILIZATION OF ELITE SYSTEM FOR PRECISE FAULT LOCALIZATION OF FUNCTIONAL FAILING INTEGRATED CIRCUIT (IC).pdf
Product
Best Paper Track for Product – STMicroelectronics, Inc.
THERMAL EXPANSION SIMULATION OF SINGULATED MOLDED SUBSTRATE THROUGH FINITE ELEMENT ANALYSIS
Quality System
Best Paper Track for Quality Systems – onsemi-Carmona
- EMPOWERING LEAN PRINCIPLES IN AUTOMOTIVE MANUFACTURING INDUSTRY - ADDRESSING THE CHALLENGES AND CAPTURING BEST PRACTICES.pdf
- HANDS-FREE TURNSTILE
- IMPROVEMENT OF LOW LEVEL EPOXY SENSING AND ELIMINATION OF HUMAN INTRUSION.pdf
- LASER CUTTING MACHINE IMPROVEMENT AND DEFECT REDUCTION THROUGH VACUUM OPTIMIZATION.pdf
- MACHINE QUALIFICATION - SETTING A NEW STANDARD.pdf
- MANAGING SCRAP - A BENCHMARK APPROACH.pdf
- REDUCTION OF QC FAILURES RELATED TOELECTRICALLY-INDUCED PHYSICAL DAMAGE.pdf
- SURFACE CONTAMINATION REDUCTION ON CLEAN BOOTH AREA.pdf
- The Flash Back - Resolving Customer Power Pad Mounting Issues through Flash Prevention and Enabling Auto Back Side Inspection.pdf
Support System
Best Paper Track for Support Systems – P.IMES Corporation
- 31st ANTS_PROCESS CONTROL AND CERTIFICATION_REDEFINING ORDINARY TO EXTRAORDINARY SOLUTIONS.pdf
- 31st ANTS_TOWARDS THE FUTURE OF DATA SCIENCE RESTRUCTURING THE UNSTRUCTURED LEGACY SOLUTIONS.pdf
- DIGITAL PRESSURE GAUGE READING USING TRANSFER LEARNING.pdf
- INNOVATIONOF ENERGY METERS THROUGHACCURATE MONITORINGON ENERGY CONSUMPTIONOF END-USER TO CREATE ENERGY EFFICIENCY AND CONSERVATION PROGRAMS.pdf
- Uninterruptible Supply of Compressed Dry Air using Liquid Nitrogen.pdf
Test Manufacturing
♦ Best Overall Industry Paper – Analog Devices, Inc.
AUTOMATED WAFER MAP CREATION FROM FINAL TEST DATA AND PATTERN CLASSIFICATION USING MACHINE LEARNING
- A SIMPLE METHOD FOF CATCHING INTERMITTENT FAILURES.pdf
- DEMYSTIFIED THROUGH PATTERNS - PROBLEM-SOLVING USING DATA ANALYSIS, DETECTION, PREDICTION, & PREVENTION.pdf
- ELIMINATION OF TEST ESCAPE ISSUES ON TEST HANDLER.pdf
- ENTANGLED UNITS’ PREVENTION - RASCO SIP TEST HANDLER HOPPER DESIGN .pdf
- EOS PREVENTION ADVOCACY - IN LINE TEST METHOD FOR CAPTURING DEFECTIVE BYPASS CAPACITORS IN TEST PERFORMANCE BOARDS THROUGH AN AUTOMATED TEST EQUIPMENT.pdf
- FINDING THESWEET SPOT - A DEEP-DIVE ANALYSIS ON NON-GENUINELOAD BOARD CHECK FAILS.pdf
- GREEN LASER - THE BREAKTHROUGH BRANDING TECHNOLOGY FOR 5G PRODUCTS.pdf
- INTELLIGENT THERMAL CONTROL & SOAK TIME REDUCTION, A SOLUTION TO IMPROVE CAPACITY AND UTILIZATION.pdf
- LIFTED LEADS ELIMINATION AT FINAL TEST USING RELIABILITYCENTEREDMAINTENANCE METHODOLOGY.pdf
- MACHINE LEARNING - FEATURE SELECTION FROM HIGH DIMENSIONAL DATA FOR EARLY DETECTION OF FAILURES ON SEMICONDUCTOR DEVICES.pdf
- MYSTERY UNLOCKED, DIAPHRAGM PRESSURE - THE KEY TO RESOLVE CONTACT SENSITIVITY.pdf
- PCB design board simulation Discovery - Eradicating Unwanted Voltage through Efficient Filter Lay-out.pdf
- RF Noise Reduction thru Test Signal Averaging.pdf
- Validation of Pressure Sensitive Adhesive asAlternative Accelerometer Attachment on Aluminum Alloy Jig under Vibration Test.pdf
- VALIDATION TO VERIFICATION(V2V) - AN ULTRAFLEX TOTEST VECTOR TRANSLATOR
2023
Assembly Manufacturing
Best Paper Track for Assembly Manufacturing – Nexperia Philippines, Inc.
DEVELOPMENT AND CHALLENGES OF HIGH FEED SPEED WAFER DICING PROCESS FOR SILICON WAFERS
- Adapting Lean & Advance Manufacturing Technology at OSS INS Assembly Line_FINAL.pdf
- ADAS_MULTI-FUNCTION_LIDAR_SCRAP_ELIMINATION.pdf
- AUGMENTING CAPABILITY OF BOTTLENECK PROCESS AT CCU BACK-END ASSEMBLY.pdf
- BRIDGE PICK TOOL MODIFICATION ON DACA MACHINES FOR TILTED CLIP AND CRACK DIE REJECT REDUCTION.pdf
- ELEVATING PROCESS CONTROL AND CERTIFICATION UTILIZING ALID.pdf
- Eliminating Inductive Kickback by Using Diode as Surge Suppressor for BSAVI Machines.pdf
- Eliminating Short Circuit on Plc Signals Through the Use of Wire Jumper for FAVI Machines.pdf
- Embracing Evolution Photoresist Stripping 2.0.pdf
- Excessive Flashing Reduction on Plad Single-Die Bi-rectional Devices Thru Stack Height Analysis.pdf
- FORGING THE FOUNDATION OF LIGHTS OUT STRATEGY FOR INSPECTION BY SUSTAINING PACKAGE EXCELLENCE THROUGH SMARTT SAMPLING.pdf
- IMPACT OF LOW TEMPERATURE MOLD CLEANER CONDITIONER ON MOLD PROCESS.pdf
- JLP CABLE ASSEMBLY AND HARNESS CYCLE TIME REDUCTION THROUGH AUTOMATIC CONTINUITY TESTING.pdf
- LINE BALANCING IN SAS LINE 6 THROUGH CYCLE TIME OPTIMIZATION.pdf
- PD• 6NH3• 2RX NEW PALLADIUM ELECTROLYTE FORMULATION ENABLING THINNER METAL OPTIMUM DEPOSITION.pdf
- PNP Head Matrix II Asynchronous Pick Body Stroke; Causes, Effects, and Solutions.pdf
- Prevention of Servomotor Burn By Replacing Motor With Higher Torque.pdf
- REDUCING ELECTRICAL TEST OUTLIERS THROUGH SILVER SINTERING DIE ATTACH METHOD OPTIMIZATION.pdf
- REDUCTION OF CRUMPLED STRIPS OCCURRENCE FOR SOHED AT MECO-01.pdf
- REDUCTION OF LOW VACUUM PRESSURE READING ON VACUUM PROCESSOR.pdf
- REDUCTION OF PROCESS CYCLE TIME THROUGH THE INNOVATION OF MANUAL OR SEMI-AUTO JIGS & FIXTURES D.I.A.D.O.I. BASED APPROACH.pdf
- SAWING PROCESS STREAMLINING BY FULL CUT INTRODUCTION ON ULTRA THIN WAFERS.pdf
- SEMI-AUTOMATIC CRIMPING MACHINE SET-UP CYCLE TIME IMPROVEMENT THROUGH STANDARDIZATION OF PARAMETER SELECTION AND KITTING PROCESS.pdf
- SOT227 PRE-FORM FINAL FORM POKA-YOKE FOR TOOL PARTS BREAKAGE.pdf
- SURFACE IONIZATION EFFECT OF MIXED GAS Ar+H2 PLASMA.pdf
- SUSTAINABLE DEVELOPMENT A GUIDE TO PLATING COST EFFICIENCY.pdf
- ULTRA SHORT PULSE (USP) LASER GROOVING A NEW SAWING TECHNIQUE TO ADDRESS DIE STRENGTH ISSUES IN THINNER PACKAGES.pdf
- WAFER SAW PROCESS IMPROVEMENT THROUGH LASER GROOVE KERF CHECK OPTIMIZATION.pdf
- WIRELESS DETECTION OF ELECTROSTATIC DISCHARGE (ESD) EVENT THROUGH.pdf
Failure Analysis and Reliability
Best Paper Track for Failure Analysis and Reliability – Integrated Micro-Electronics, Inc.
DELAMINATION ANALYSIS OF AN ALN (DIRECT BOND COPPER SUBSTRATE) USING FINITE ELEMENT ANALYSIS (FEA)
- Conductive Die Attach Delamnination on C19210.pdf
- DELAMINATION ANALYSIS OF AN ALN (DIRECT BOND COPPER SUBSTRATE) USING FINITE ELEMENT ANALYSIS (FEA) - BA, BM, CVC.pdf
- Elimination of Peel Off UV Adhesive on UV Shoulder.pdf
- Fractographic Analysis of Die Crack Simulated Under Different Fracturing Conditions.pdf
- HIGHLY ACCELERATED LIFE TEST AND ENVIRONMENTAL-3 ORT OPTIMIZATION_GSumalinog.pdf
- Impact of Die Attach Film Elastic Modulus on Adhesion and Package Reliability.pdf
- OUTRIGHT DETECTION OF DR TO DIA ASSY LEVEL RELIABILITY FAILURES_DPatarata.pdf
- Risk of Bulk Containers for ESD Sensitive Devices.pdf
- Validation of Pressure Sensitive Adhesive Naredo-Ebero-Diwa.pdf
Product
Best Paper Track for Product – Ampleon Philippines, Inc.
- ADDRESSING CRITICAL WIREBOND LOOP CHALLENGES ON AUTOMOTIVE MEMS DEVICE WITH STACKED-DICE CONFIGURATION.pdf
- Control and Simulation of electrolytic migration_fullpaper.pdf
- Deep-Dive Investigation on Pad Discoloration Issue in Optical Sensing Device.pdf
- Introduction of Descaling for the Improvement of Half Cut Singulation Process of Wettable Flank QFN Packages.pdf
- Optimal Design of SiC MOSFET Half Bridge Power Module for 200A Current Rating based on Electrothermal Simulation.pdf
- Solder-induced HAST Failures.pdf
Quality System
Best Paper Track for Quality Systems – STMicroelectronics, Inc.
- CACB RASCO JUPITER 2 COMMITTED MANUFACTURING CAPACITY (CMC) INSERTION IMPROVEMENT.pdf
- CHALLENGING THE PROCESS AND MATERIAL CHARACTERISTIC TO ADDRESS THE HIGH EPOXY USAGE CONSUMPTION OF VI POWER PACKAGES.pdf
- COMPARATIVE STUDY OF TWO SCANNING TECHNIQUES IN AUTOMATIC SIDE VISUAL INSPECTION OF WETTABLE FLANK QFN PACKAGES.pdf
- Device “T” Electrical Yield Improvement.pdf
- DEVISING VARIATION REDUCTION TECHNIQUES FROM STATISTICAL PROCESS CONTROL (SPC) SIGNALS TO ACHIEVE WIREBOND PROCESS STABILITY.pdf
- ELIMINATION OF BROKEN WIRE AT HEEL FOR SSOP PACKAGE.pdf
- ELIMINATION OF CONDUCTIVE DIE ATTACH FILM INTERFACIAL DELAMINATION DUE TO INTRINSIC HIGH ASPECT RATIO ULTRATHIN HIGH DIE BOW LEVEL.pdf
- Elimination of Mixed Device_onsemi Car_Eugenio.pdf
- Elimination of PCBA Related Functional Defects on Amber or Opal Machine by Improving M03-A13-00 Jadeback Connector Assembly using Sold.pdf
- ELIMINATION OF RBFA DISTURBED WIRE OCCURRENCE.pdf
- FT Guardband A Structural Solution Control in Screening Lots for Test.pdf
- IMPROVED MOLD TOOL DESIGN ROBUSTNESS THROUGH THE DMAIC PROCESS (Nexperia_WPena)
- LEADTIME IMPROVEMENT – BALANCED ARMATURE AGING REDUCTION_MPTorralba.pdf
- NETWORK SYSTEMS SOLUTIONS INTEGRATION TO ELIMINATE MISSING OR INCOMPLETE SUPPLIER KEY DATA USED FOR COMPONENT TRACEABILITY.pdf
- OVER REJECTION DOWNTIME REDUCTION THROUGH MAGNETIZED CLEANING BRUSH.pdf
- Reduction of 3rd Opt Yield Off and Fallen Units_Technical Paper Template.pdf
- REDUCTION OF DENTS THROUGH INSTALLATION OF EJECTOR PINS ON COMPOUND DIE.pdf
- Reduction of DIGHSB Board Failure on Device “S”.pdf
- Reduction of Module 2 Detape Rate.pdf
- REDUCTION OF OVER REJECTION AT 5 SIDES VISION OF TEST & TAPE MACHINES.pdf
- REDUCTION OF STRAY WIRE RBFA INCIDENT AT WIRE BOND.pdf
- TESTING PROCESS ROBUSTNESS ELIMINATION OF POTENTIAL MIXING CUSTOMER COMPLAIN THROUGH ERROR PROOFING METHODOLOGY.pdf
- Three_Way_Test_Detection_Enhancement_Paper.pdf
- VALUE STREAM MAPPING (VSM) ON MAP AVAILABILITY AT INCOMING QUALITY CONTROL (IQC) PHASE A LEAN APPROACH TO LEAD TIME REDUCTION AND MANUFACTURING EFFICIENCY IMPROVEMENT.pdf
Support System
Best Paper Track for Support Systems – Knowles Electronics Philippines
DATA ANALYTICS THROUGH FAILURE CODE TRIGGER AND MULTI-LEVEL SCORECARD
- AUTOMOLD CELL CONTROLLER AUTOMATION OF MOLD MACHINES TO REDUCE QUALITY ISSUES.pdf
- DATA ANALYTICS THROUGH FAILURE CODE TRIGGER AND MULTI-LEVEL SCORECARD.pdf
- Elimination of External and Internal Findings_onsemi Car_Gabriel.pdf
- IMPROVEMENT OF PRODUCT RELEASE CHANGE ORDER (PRCO) PROCESS THROUGH PIMES SYSTEM INTEGRATION AND DIGITIZATION.pdf
- REUSING OF REVERSE OSMOSIS (RO) REJECT WATER THROUGH CREATION OF WATER HARVESTING SYSTEM TO CONSERVE WATER
Test Manufacturing
♦ Best Overall Industry Paper – Analog Devices General Trias, Inc.
TEST EQUIPMENT INTELLIGENT EDGE SOLUTION FOR PACKAGE CRACK PREVENTION
Best Paper Track for Test Manufacturing – onsemi Carmona
ONE-SHOT PPE DETECTION FOR BAKE OVENS USING RESNET50 CONVOLUTIONAL NEURAL NETWORK
- 3D SIMULATION SOFTWARE EFFECTIVE TOOL ON REDESIGNING CLAMPING MECHANISM FOR DAMAGED STRIP ELIMINATION.pdf
- AN INNOVATIVE SOLUTION TO ELIMINATE MANUAL HANDLING WITH THE INTRODUCTION OF AUTO FLIPPER TECHNOLOGY FOR DEAD BUG MODULE.pdf
- ELIMINATION OF MIXING OF TESTED AND UNTESTED UNITS AT SENSOR FINAL TEST USING MECHANICAL ERROR-PROOFING_32nd ANTS_Technical Paper Template_V00_20230623.pdf
- IMPROVING CONTACT RELIABILITY THRU RCM APPROACH.pdf
- Issue Resolution Cycle Time Reduction in Test Escape and Mixing Events using Jira.pdf
- Latch-up Tester Hidden Threats Beneath 100V 1A_final.pdf
- QC FAILURE ELIMINATION PREDICTING CURRENT SENSE TEST FAILURES THROUGH LINEAR REGRESSION.pdf
- TEST HANDLER JAM REDUCTION AN IN-DEPTH ROOT-CAUSE ANALYSIS APPROACH ON UP DOWN MOTOR ASSEMBLY FAILURE USING RELIABILITY CENTERED MAINTENANCE (RCM) METHODOLOGY.pdf
- Tester Efficiency Improvement
2024
Academe
Best Paper Track for Academe – FAITH Colleges (First Asia Institute of Technology and Humanities)
IOT-Driven Power Monitoring and Centralized Control System for Energy Conservation
- Detection of Violators of Garbage Disposal.pdf
- GESTULEARN HAND TRACKING AND GESTURE RECOGNITION TECHNOLOGY FOR ASSISTIVE TEACHING IN SPECIAL EDUCATION.pdf
- Real-Time-Airconditioning-Unit-Monitoring-System-with-Analytics-for-Predictive-Maintenance.pdf
- SMART WASTE MANAGEMENT IN POULTRY FARMS MONITORING AND CONTROLLING AMMONIA AND FLY INFESTATIONS.pdf
Assembly Manufacturing
♦ Best Overall Industry Paper – Texas Instruments Philippines, Inc. – Clark
Enabling Zero Chemistry Maintenance Thru a Novel Universal Analyzer Powered by EODT Neural Framework
Best Paper Track for Assembly Manufacturing – onsemi Carmona
- ACHIEVING OPTIMAL PROCESS EFFICIENCY-AUTOMATED SOLUTIONS FOR PRODUCT SAMPLING AND TOOL STATE CHANGE.pdf
- APPLICATION OF PACKAGE STRESS REDUCTION STUDY REENGINEERING OF CHUTE PUSHER SPRING HOLDER ASSEMBLY FOR CLIPBONDED HANMI TRIM AND FORM MACHINES.pdf
- Arduino UNO and Design Thinking Empowers Tape Curing Process Control Advancements.pdf
- AUTOMATED CYCLE TIME AND PROCESS BOTTLENECK ANALYSIS THROUGH INTEGRATION OF AI INTO EXCEL'S MACRO PROGRAMMING.pdf
- Boosting E88_RascoDT_Throughput_A Lean Approach to Machine Utilization.pdf
- CURRENT SENSOR CAPACITY IMPROVEMENT.pdf
- DIE ATTACH CHANGE IN EPOXY WEIGHT FOR CONSUMPTION REDUCTION.pdf
- Effective way of extracting weight of composite materials.pdf
- ELIMINATION OF MANUAL TEMPERATURE & RELATIVE HUMIDITY MONITORING THROUGH AUTOMATIC DATA LOGGER & REAL-TIME NOTIFICATION SYSTEM.pdf
- Enhancing Semiconductor Fabrication Through Operational Optimization and Cost-Efficiency through N2 removal strategies.pdf
- INTELLIGENT VIDEO ANALYTICS FOR IMPROVING MAN-TO-MACHINE-RATIO (MMR) IN AN ASSEMBLY LINE.pdf
- Leading Indicator Detection through SPC input Variable Controls S.Novio.pdf
- LENS GLUE DISPENSE ATTACH IMPROVEMENT THROUGH FLUID PRESSURE OPTIMIZATION TO COMPENSATE HIGHER VISCOSITY AND TO MEET REQUIRED PRODUCTION OUTPUT.pdf
- Optimizing Cost Efficiency - Product Cost Reduction for Product X BAs_MSorallo.pdf
- PREVENTION OF MOTOR AND SENSOR ASSEMBLY FAILURES FLOW-OUT BY INTRODUCING IMPROVISED TESTING EQUIPMENT.pdf
- PROCESS SIMPLIFICATION THROUGH ELIMINATION OF PRE-CUT, COVERLAY AND DE-TAPE PROCESS FOR MEMS INSTRIP PACKAGES.pdf
- REDUCTION OF CYCLE TIME THROUGH ELIMINATION OF SINK MARK BY IMPROVING THE MOLD DESIGN.pdf
- Scalable Platform Approach for Analyzing Change in Manufacturing Data.pdf
- Streamlining Quality, Efficient Process, Batch Lot Optimization Through Value Stream Mapping and Lean Sigma with Elite Inline Repair System.pdf
- SYSTEMIC APPROACH ON ROOT CAUSE ANALYSIS OF BANDGAP FAILURE FOR YIELD IMPROVEMENT OF QFN DEVICES.pdf
- THE EFFECTIVE USE OF TRIZ METHODOLOGY IN THE OPTIMIZATION OF THE TERMINAL SOLDERING PROCESS OF BALANCED ARMATURES.pdf
- TRANSFORMING PAPER-BASED WORK INSTRUCTIONS INTO ANIMATED CAD SIMULATIONS WITH AI-GENERATED CAPTIONS.pdf
- Unsupervised Change Detection for Within-Run Manufacturing Data.pdf
- VIRTUAL PARTS TRACKING USING AUGMENTED REALITY (AR) IN AN ASSEMBLY LINE.pdf
- WAFER TOP METALLIZATION ANOMALY DETECTION at 3RD OPT 3.pdf
- WIREBOND MONITORING SIMPLIFICATION AND CYCLE TIME IMPROVEMENT BY ELIMINATION OF NON-VALUE ADDED ACTIVITIES.pdf
Failure Analysis and Reliability
Best Paper Track for Failure Analysis and Reliability – Toshiba Information Equipment (Phils.), Inc.
Deep Learning Application for Automated Classification of Particle Morphology In Root Cause Analysis
- A STUDY ON THE EFFECT OF BLACK SILICON DIE ON THE INFRARED IMAGING.pdf
- CHARACTERIZATION OF EPOXY GLUE ADHESION PERFORMANCE ON GOLD PLATED COPPER SUBSTRATES.pdf
- Characterization of Protective Films_Abayari Cueva Patrocenio_Manuscript.pdf
- DEFINING THE DIE ATTACH SINGLE VOID CRITERIA ON A GALLIUM NITRIDE (GaN) RF POWER TRANSISTOR IN AN AIR CAVITY CERAMIC (ACC) PACKAGING.pdf
- Effective Failure Analysis Approach in Uncovering Gate-to-Drain Source Tungsten Spur Fabrication Defect.pdf
- Exploring Failure Distribution Plots for Predictive Lifetime Analysis in the Qualification of Silver Sinter Die Attach Material in Air Cavity Package.pdf
- FAULT TREE ANALYSIS OF PNP HEAD LINEAR MOVEMENT FAILURE ON X-PITCH ASSEMBLY.pdf
- FINDING THE DIE CONFIGURATION THAT CAN OVERCOME MECHANICAL ASSEMBLY STRESSES USING LABORATORY SCALE SIMULATION SET UP.pdf
- FINITE ELEMENT ANALYSIS ON WIRE BOND BREAK DURING TC AND PTC EVALUATING ENCAPSULANT MATERIAL CHANGE AS A POTENTIAL SOLUTION.pdf
- FRACTAL GEOMETRY, IMAGE ANALYSIS & THERMAL PROFILING v2.pdf
- High Precision Selective Backside Decapsulation Technique_onsemi Carmona.pdf
- Optimizing Rel Quals of Balanced Armatures - Acc Test Conditions_GSumalinog.pdf
- Pre-EMC Testing in ATC versus an EMC Test Laboratory.pdf
- Viability of Plasma Cleaning_33rd ANTS Technical Paper_rev01.pdf
Product
Best Paper Track for Product – Ampleon Philippines, Inc.
- Chem Selection in UV-Cured Adhesives for Drive Rod Bonding of BAs_DPatarata.pdf
- Comparative Performance Evaluation of Copper Wire Compositions_onsemi Carmona.pdf
- ETCHED TO STAMPED LEADFRAMES AS A COST-EFFECTIVE SOLUTION TO COPPER LEADFRAME SUPPLY_r2.pdf
- Harmonization of DC Thermal Resistance Settings and Limits of RF Power Transistors.pdf
- SILVER SINTER MATERIAL DISPENSE OPTIMIZATION ELIMINATION OF SINTERING VOIDS DEFECT FORMATION IN GALLIUM NITRIDE DIE ATTACH.pdf
- SILVER SINTERING DIE ATTACH GALLIUM NITRIDE DIE TECHNOLOGY PACKAGING SOLUTION AND ALTERNATIVE TO EUTECTIC GOLD-TIN (AuSn) DIE ATTACH.pdf
- STRATEGIC DEPLOYMENT OF EFFECTIVE AND EFFICIENT METHODOLOGICAL CONTROLS OF FOREIGN MATERIAL INTERFERENCE IN WAFER-LEVEL 1K MANUFACTURING CLEANROOM ENVIRONMENT.pdf
- THERMAL STABILITY ASSESSMENT OF STANDARD & REDUCED Ni(Co)-Pd-Au METALLIZATION THICKNESS ON Cu-Mo70Cu-Cu HEATSPREADERS THROUGH SURFACE CHARACTERIZATION.pdf
- WAFER RECONSTRUCTION PROCESS – A BREAKTHROUGH TECHNOLOGY SOLUTIONS EMPLOYED TO TECHNICAL DIFFUSER WAFER PREPARATORY MANUFACTURING.pdf
- WAFER SAW PROCESS CHARACTERIZATION OF GALLIUM NITRIDE (GaN) WAFER TECHNOLOGY.pdf
Quality Systems
Best Paper Track for Quality Systems – Western Digital Corporation
- CHALLENGE TO ERROR PROOFING AUTOMATED INSPECTION SOLUTIONS TO EMBEDDED COSMETIC DEFECTS ON OPTICAL DIFFUSER WAFER USING HIGH RESOLUTION CHROMA EQUIPMENT.pdf
- CHALLENGING CURRENT CUSTOMER REQUIREMENT OF CHANGING PROCESS _A SIX SIGMA PROJECT REDUCTION OF IN-PROCESS DEFECT RATE IN SOLDER PASTE PRINTING PROCESS.pdf
- ELECTRONIC MEASUREMENT SYSTEM ANALYSIS.pdf
- ELIMINATION OF DAMAGE CARRIER TAPE FOR DFN8 2X2 PACKAGE IN PICKER MACHINE.pdf
- ELIMINATION OF LIFTED BALL BOND ABNROMALITY ON SQFP PACKAGE.pdf
- EMBARKING AN INTEGRAL YIELD OPTIMIZATION JOURNEY THROUGH TECHNICAL RESEARCH UNCOVERING INNOVATION AND OPPORTUNITIES AT MIT WAFER RECONSTRUCTION PROCESS.pdf
- ENHANCED AUTOMATED VISUAL INSPECTION MANAGEMENT FOR QUALITY CONTROL AUTOMATIC DEFECT CLASSIFICATION (ADC) Technical Paper Template.pdf
- ENSURING OPERATOR'S SAFETY DURING SPOTWELDING OF FRAME R 7160 THROUGH THE FABRICATION OF A WELDING JIG.pdf
- FAILURE ANALYSIS OF PICK-AND-PLACE'S BRAKE PROBLEM THROUGH MULTIFACTORIAL EXPERIMENTS.pdf
- HARD STAIN PPM REDUCTION IN POTTING STATION THROUGH EFFECTIVE AND ROBUST DESIGN OF TAPE TRACK COVER.pdf
- INNOVATION AND INCLUSION OF POU DESICCANT DRYER TECHNOLOGY TO ELIMINATE PAD DISCOLORATION CAUSED BY INTERACTION OF CDA MOISTURE TO METALLIC LGA PADS.pdf
- LEADFRAME TAPE DE-REEL PREVENTION AT WIREBOND MACHINE THROUGH SENSOR INTEGRATION.pdf
- MODEL G & H SOFTWARE MALFUNCTION RESHIP REDUCTION.pdf
- Model S Yield Improvement Through Failed Adjust Reduction.pdf
- PHONE POWER RESHIP REDUCTION FOR PHONE 3 MODEL.pdf
- PROBE DAMAGE REDUCTION USING KAIZEN METHODOLOGY.pdf
- REDUCTION OF DENTS DUE TO FLOATING SCRAP THROUGH INSTALLATION OF COUNTERBORE TYPE LOWER DIE CUTTING INSERT.pdf
- REDUCTION OF IGBT SIDE WALL CRACK.pdf
- REDUCTION OF KELVIN CHECK FAILURE OF DEVICE A AT QFN TES.pdf
- REDUCTION OF MACHINE FAILURE THROUGH ERROR PROOFING METHODOLOGY.pdf
- REDUCTION OF OVER REJECTION AT MARKING, ORIENTATION, AND PACKAGE (MOP) VISION INSPECTION OF DEVICE X.pdf
- REDUCTION_OF_NON-STICK_ON_LEAD_ON_CU_LEAD_FRAME_WITH_AG_SPOT.pdf
- Smart Manufacturing_Integrating Factory Look for Efficiency and Innovation
Support Systems
Best Paper Track for Support Systems – onsemi Carmona
- Data Analytics Through Automated Z-Score Diagnostic.pdf
- Efficient Shuttle Operations.pdf
- Natural Language Processing Enabled Natural Calamity Proactive Crisis Management.pdf
- Start-up Checklist Migration to Universal Data Collection.pdf
- UNLOCKING INSIGHTS FROM MULTIMODAL DATA ADVANCED DATA ANALYTICS FOR COMPLEX DATA SOURCES AND PROCESSING.pdf
- Wafer Probe Equipment and Analog Hardware Maintenance.pdf
Test Manufacturing
Best Paper Track for Test Manufacturing – Western Digital Corporation
Tester Anomaly Detection with Machine Learning Model Prediction
- ACCELERATING TEST CAPACITY THROUGH SELECTIVE POWER REGULATION AND PULSE SETTINGS OPTIMIZATION.pdf
- ATE POWER SUPPLY DELTA AUTOMATION - THE POWER OF PREDICTING TESTER SHUTDOWNS.pdf
- BEST TOOL MATCHING METHODOLOGY.pdf
- CDSEM Automated Inspection and Defects Classification.pdf
- COUNT TRIANGULATION SYSTEM THAT SUBSTANTIATES TEST COUNT FROM TESTER, HANDLER, AND PHYSICAL UNIT VIA DATALOG, API COMMAND AND OTSR, TO TRAP UNIT MIXING IN SEMICONDUCTOR FINAL TEST MANUFACTURING.pdf
- DEVICE TEST TRACEABILITY AN ENHANCED APPROACH FOR UNIT LEVEL TRACEABILITY IN FINAL TEST.pdf
- ELEVATING EFFICIENCY- KAKAROT SUPER GUI'S JOURNEY TOWARDS ENHANCED PRODUCTIVITY.pdf
- EMPLOYING AUTOMATION OF DIRECT CURRENT RESISTANCE TESTING UTILIZING EG PROBER ON RECONSTRUCTED WAFERS FOR A COMPREHENSIVE SOLUTION OF BROKEN TRACE DETECTION AT DIE-LEVEL CIRCUITRY.pdf
- Final Test Data Checker (FTDC) A SYSTEM-BASED APPROACH ON DETECTING A POTENTIAL DEVICE MIXING ISSUE AT FINAL TEST 2 2.pdf
- MSOP Handler PPJ Improvement Using BTM Methodology.pdf
- PROBE CONTACT FORCE_ SIGNIFICANT FACTOR IN REDUCING CONTACT.pdf
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