Networking Committee Meetings
The Networking Committees (NWCs) are attended by Directors/Senior Managers, Managers and supervisors, to act as the platform for benchmarking and exchange of ideas. Through the NWCs, SEIPI organizes a wide variety of training programs to strengthen the global competitiveness of the industry.
AESSEP is the venue for sharing of best known practices on environmental health and safety, plant engineering and facilities maintenance, space utilization and operation reliability. Its vision is to be the role model among various industries in ensuring safety in the workplace, preserving the environment and keeping abreast mission is to encourage members to achieve and maintain a safe and environment friendly industry through: continuous education and training, compliance to regulations and standars, clean technology, energy management, equipment reliability and facilities management.
NAME | COMPANY | NWC POSITION |
|---|---|---|
Jocelyn Daluraya | Analog Devices | Chairperson |
Rosanna Espiritu | onsemi | Deputy Chairperson |
Augusto Sibulo | Aumovio | Training |
Jonathan Topacio | Philippine Manufacturing Co. of Murata | Training |
Joseph Antonio | Ionics EMS | R&D/ROADMAP |
Mylene Armamento | Amkor Technology | R&D/ROADMAP |
Rendolf Tubay | Maxeon Solar Technologies | Advocacy |
Jasmin Capangpangan | Minebea Mitsumi | Advocacy |
Jhondaved Oruga | Microchip Technology | Information |
Rodel Carino | Texas Instruments | Information |
Edgard Reyes | Western Digital | Networking |
Sandra Chu | Toshiba Information | Networking |
Lyka Estrella | Gruppo EMS | Services |
2024 Priorities
2024 Projects
Training
R&D/Research
Advocacy
Information
Networking
Service
Q1
Q2
Q3
Q4
For more information, please contact jade.dayag@seipi.org.ph
SEIPI’s networking committee that continuously works on the best security professional practices, which shares a common goal amongst SEIPI members. Its vision is to provide leadership role in the design and propagation of effective security business practices and application for semiconductor and electronics industries in the Philippines.
NAME | COMPANY | NWC POSITION |
|---|---|---|
Athena Montevirgen | Phil. Manufacturing Co. of Murata | Chairperson & Networking |
Dustin Dreyfus | Western Digital | Deputy Chairperson |
Emyr Ramos/Marvin Tongol | Toshiba Info. | Training |
Norman Alpuerto | Aumovio | Training |
Jess Aleluya | Integrated Micro-electronics Inc. | Training |
Robinie Batacandolo | Leandre Llanera | Microchip Technology Inc. | R & D/Roadmap |
Edward Pena | onsemi | R & D/Roadmap |
Joey Maglente | Amkor Technology Phils. | R & D/Roadmap |
Jess Peralta | Maxeon Solar | Advocacy |
Nestor Pepito | Ionics EMS | Advocacy |
Mario Cuesta Jr. | Analog Devices | Information |
Dustin Dreyfus | Western Digital | Information |
Pete Sherwin Villanueva | Erwin Abao | Teradyne | Networking |
Patrick Chagsan | TI Phils. | Services |
Ely Del Mundo | Gruppo EMS | Services |
Victor Magpantay | Minebea Mitsumi | Services |
Jess Aleluya | Integrated Micro-electronics | Adviser |
Pol Camacho | Nilo Pomaloy | Shieldcoach Security Company | Adviser |
Top three (3) priorities for 2024
Training
R&D
Advocacy
Information
Networking
Service
ASEFEX is the gathering of finance executives practicing in the semiconductor and electronics industry, bonded by the spirit of volunteerism for the benefit of the industry as a whole and members’ respective companies in particular. ASEFEX envisions to be the strategic partner of SEIPI in driving the Philippine semiconductor and electronics industry towards global competitiveness through excellence and leadership in the field of finance. Its mission is to advocate the development, implementation and advancement of the industry by promoting information sharing, benchmarking, training and development, values formation and networking on relevant financial issues for the benefit of SEIPI member companies and the industry as a whole.
NAME | COMPANY | NWC POSITION |
|---|---|---|
Aimee Banzuela | Analog Devices | CHAIRPERSON |
Barbara Dela Cruz | Gruppo EMS | DEPUTY CHAIRPERSON |
Alec Matias | Maxeon Solar | TRAINING |
Olivia Cabatingan | Minebea Mitsumi | TRAINING |
Mary Jane Abangan | Teradyne | R&D/ROADMAP |
Ron Andrade | Ionics EMS, Inc. | R&D/ROADMAP |
Rafaela Yoly Umbao | Microchip Technology | ADVOCACY |
Mack Good | Texas Instruments Philippines | ADVOCACY |
Marvi Mangona | Aumovio | INFORMATION |
Geraldine Decena | onsemi | INFORMATION |
Rowena Cecilio | Toshiba | NETWORKING |
Rhea Maunahan | Philippine Manufacturing of Murata | SERVICES |
Marivic Perlada | Western Digital | SERVICES |
Dexter Medilla | Asurion | ADVISER |
Willy Garcia | Amkor Technology | ADVISER |
Quarterly Meetings
March
June
September
December
For more information, please contact analin.lozano@seipi.org.ph
ASEMEP provides support to member-companies in benchmarking manufacturing activities, technical trainings and strategic planning. It hosts the annual National Technical Symposium aimed at showcasing technical expertise of SEIPI semiconductors and electronics engineers. The group is likewise pursuing a strong and active
Academe-Government-Industry Forum to help shape a more relevant technical and engineering education curriculum
Under ASEMEP are four (4) Community of Practices (COPs) whose objective is to foster intellectual exchange between different engineering practices in the semiconductor and electronics industry.
These are:
- Semiconductor and Electronics Training Council (SETC)
- ASEMEP ESD Council (AEC)
- ASEMEP Quality and Productivity Council (AQ&PC)
- Council of Failure Analysis and Reliability (CFAR)
Vision
Create ENABLED manufacturing engineers in the semiconductor and electronics industry. Engineers Networked to achieve Advanced technology Breakthroughs that would Lead to Economic and social Development.
Mission
To keep our fellow engineers abreast with the technological development both in local and foreign endeavors. To promote and participate in programs supportive of both industry and national interest, particularly in technical skills development, industry-academe linkage and corporate social responsibility. To be the preferred venue and forum where engineers can share their technical competence. To enable community of practices that will foster intellectual exchange.
ASEMEP COMMUNITY OF PRACTICE (COPs)
NAME | COMPANY | NWC POSITION |
|---|---|---|
Laura Clemente | Texas Instruments | CHAIRPERSON |
Aileen Jara | Western Digital | DEPUTY CHAIRPERSON |
Ronald Hilaria | Integrated Micro-Electronics, Inc | TRAINING |
James Baello | onsemi Carmona | TRAINING |
Ian Harvey Arellano | ST Microelectronics, Inc. | R&D/ROADMAP |
Annabelle Serrano | Aumovio | R&D/ROADMAP |
Emma Gerodias | Ionics EMS, Inc. | ADVOCACY |
Chito Del Mundo/Guillermo Mendoza | Gruppo EMS, Inc. | ADVOCACY |
Lhen Leslie Cometa | Microchip Technology | INFORMATION |
Dennis Aguilar | Phil. Manufacturing Co. of Murata | INFORMATION |
Aileen Jara | Western Digital | NETWORKING |
Ruth Jacob | Amkor Technology Philippines, Inc. | NETWORKING |
Rholet Ursais | Toshiba | SERVICES |
David Martinez | Teradyne | SERVICES |
Rey Luares | Analog | ADVISER |
Peter Awayan | onsemi | ADVISER |
1.1 ASEMEP ESD COUNCIL (AEC)
NAME | COMPANY | NWC POSITION |
|---|---|---|
Ferdinand Macalintal | Amkor Technology Philippines, Inc. | CHAIRPERSON |
Ian Kenneth Santiago | Texas Instruments Philippines, Inc | DEPUTY CHAIRPERSON |
Vincent Confesor | STMicroelectronics, Inc. | TRAINING |
Eduard Joseph Amutan | Gruppo EMS, Inc. | TRAINING |
Genes Encontro | Teradyne Philippines, Ltd. | TRAINING |
Ray Nicanor Tag-at | Western Digital | R&D/ROADMAP |
Roger Dumpit | STMicroelectronics, Inc. | R&D/ROADMAP |
Bobby Tovera/Julius Jusay | Microchip Technology | ADVOCACY |
Arnold Laddran | onsemi (Carmona) | ADVOCACY |
Jose Pulgado Jr. | AUMOVIO | INFORMATION |
Aireen Luna | Philippine Manufacturing Co. of Murata | INFORMATION |
Ely Torrecampo | Ionics EMS, Inc | NETWORKING |
Raymond Sietereales | Analog Devices | NETWORKING |
Estrellita Nave | Toshiba | SERVICES |
1.2 ASEMEP QUALITY & PRODUCTIVITY COUNCIL (AQ&PC)
NAME | COMPANY | NWC POSITION |
|---|---|---|
Arreane Earl Garcia | Western Digital | CHAIRPERSON |
Emilan Sordan | Toshiba | DEPUTY CHAIRPERSON |
Crescencio Penton | Philippine Manufacturing Co. of Murata | TRAINING |
Rex Robielos | Analog Devices | TRAINING |
Rosalyn Ochea | Amkor Technology | TRAINING |
Arreane Earl Garcia | Western Digital | R&D/ROADMAP |
Marie Antazo | Automated Technology | R&D/ROADMAP |
Eloisa Cacho | Texas Instruments | R&D/ROADMAP |
Gerefil Sayson | Teradyne | ADVOCACY |
Emilan Sordan | Toshiba | ADVOCACY |
Janine Baniqued | Aumovio | INFORMATION |
Janice Bagsit | Microchip Technology | INFORMATION |
Sheila Dela Pena | Gruppo EMS | NETWORKING |
Mary Nel Legaspi | Ionics EMS | NETWORKING |
Jeanette Baybay | SunPower Philippines Manufacturing Ltd. | SERVICES |
Ryan Trinidad | onsemi Carmona | SERVICES |
Chyrey Saludo | onsemi Tarlac | SERVICES |
1.3 COUNCIL FOR FAILURE ANALYSIS & RELIABILITY (CFAR)
NAME | COMPANY | NWC POSITION |
|---|---|---|
Flordeliza Llaneta | Western Digital | CHAIRPERSON |
Jennifer Ballesteros | Toshiba | DEPUTY CHAIRPERSON |
Jason Lagar | onsemi (Carmona) | TRAINING |
Jesse Jagape | STMicroelectronics | TRAINING |
Gilbert Diwa | Integrated Micro-Electronics | R&D/ROADMAP |
Jeffrey Leo Aguila | Philippine Manufacturing Co. of Murata | R&D/ROADMAP |
Nerwin Beronio | Microchip Technology | ADVOCACY |
Charlie Estela | Microchip Technology | ADVOCACY |
Celia Corpuz | Amkor Technology | INFORMATION |
Jude Solano | Texas Instruments | INFORMATION |
Marie Lianne Alido | AUMOVIO | NETWORKING |
Romeo De Guzman Jr. | Analog Devices | NETWORKING |
Leo Mirabuna | Ionics EMS | SERVICES |
Clarie Ann Salarioza | Gruppo EMS | SERVICES |
1.4 SEIPI TRAINING COUNCIL (SETC)
NAME | COMPANY | NWC POSITION |
|---|---|---|
Erwin M. Aguilar | AUMOVIO | CHAIRPERSON |
Paolo Raval | onsemi (Carmona) | DEPUTY CHAIRPERSON |
Ronald A. Gabasan | Integrated Micro-Electronics | TRAINING |
Rjey Ramos | onsemi (Carmona) | TRAINING |
April Leen Lopena | Ibiden Philippines | TRAINING |
Nordeliza Tinacba | Toshiba | TRAINING |
Pamela Joyce Landicho | AUMOVIO | TRAINING |
Sheila Oyao | onsemi (Cebu) | R&D/ROADMAP |
Genes Encontro | Teradyne Philippines | R&D/ROADMAP |
Mark Anthony Ramiro | STMicroelectronics | R&D/ROADMAP |
Lester Uy | Microchip Technology | ADVOCACY |
Rumela Fei Gloriani | Analog Devices | ADVOCACY |
Jerry Salangsang | Gruppo EMS | INFORMATION |
Nicolas Agor III | Ionics EMS | INFORMATION |
Snooky Jarina | SunPower Philippines Manufacturing | INFORMATION |
Patricia Paula Quicoy | Amkor Technology | NETWORKING |
Mary Rose Garcia | Philippine Manufacturing Co. of Murata | NETWORKING |
Ellaine Mendoza | Texas Instruments | NETWORKING |
Rechelle Manguiat | Integrated Micro-Electronics | SERVICES |
Joycel Ipil | Western Digital | SERVICES |
Marlyn Losabio | Philippine Manufacturing Co. of Murata | SERVICES |
Top 3 Priorities for 2024 (ASEMEP)
Top 3 Priorities for 2024 (AEC)
Top 3 Priorities for 2024 (AQ&PC)
Top 3 Priorities for 2024 (SETC)
Top 3 Priorities for 2024 (CFAR)
(ASEMEP)
Training
R&D
Advocacy
Information
Networking
Service
(SETC)
Training
R&D
Advocacy
Information
Networking
Service
(CFAR)
Training
R&D
Advocacy
Information
Networking
Service
(AEC)
Training
R&D
Advocacy
Information
Networking
Service
(AQ&PC)
Training
R&D
Advocacy
Information
Networking
Service
2025 NWC WEBINAR SCHEDULES
ASSOCIATION OF SEMICONDUCTOR AND ELECTRONICS MANUFACTURING ENGINEERS OF THE PHILIPPINES
(ASEMEP
Online team building (ASEMEP and
COPs)
Q2 GMM
Q3 GMM
Joint webinar with ASITEP and
AESSEP on Q3 (IR 4.0)
ANTS 2025
CSR Activity for all COPs
For more information, please contact us at rose.duazo@seipi.org.ph
ASEMEP ESD COUNCIL (AEC)
Q2 GMM
Q2 GMM
Virtual ASEMEP National Technical
SymposiuM
For more information, please contact us at rose.duazo@seipi.org.ph
ASEMEP QUALITY & PRODUCTIVITY COUNCIL (AQ&PC)
Q1 RMM
Q2 RMM
AQ&PC BENCHMARKING CONVENTION
Q4 RMM
For more information, please contact us at rose.duazo@seipi.org.ph
COUNCIL FOR FAILURE ANALYSIS & RELIABILITY (CFAR)
Q1 RMM
Q2 RMM
Q3 RMM
CFAR Virtual Annual Forum
For more information, please contact us at oscar.pardenas@seipi.org.ph
SEIPI TRAINING COUNCIL (SETC)
Q1 RMM
Q2 RMM
SETC Training Summit
Q4 RMM
For more information, please contact us at oscar.pardenas@seipi.org.ph
2022
Academe
Best Overall Academe Paper – First Asia Institute of Technology and Humanities (FAITH)
GROUND FISSUE DETECTION SYSTEM USING RASPBERRY PI AND DRONE TECHNOLOGY
- AQMoD An IoT Implementation of Air Monitoring, Mapping , and Warning System Using Drone Technology.pdf
- BIKESECURE - An IoT - Based Bicycle Security System With Image Capturing and Location Tracking.pdf
- Cashless and Contactless Fare Payment System for Public Utility Vehicle.pdf
- Low-Cost Solar-Powered Hydroponics Water Quality Automation System.pdf
- Microcontroller-Based Automated Disinfection Machine With Attendance and Temperature Monitoring System.pdf
- Real-Time Facemasks Detection With Temperature Checking System.pdf
- Smart Hard Hat With Emergency Alert and Tracking System Using Arduino.pdf
- Solar-Powered Greenhouse System for Lettuce Using Arduino.pdf
Assembly Manufacturing
Best Paper Track for Assembly Manufacturing – Texas Instruments Philippines Incorporated-Baguio
- A Capacity Up Improvement in Printed Circuit Board Assembly (PCBA) Removal Thru Total Productive Industrial Engineering (TPIE) Approach.pdf
- Bond Pad Crack Elimination on Power Semiconductor Devices With Sensitive Bond Pad Structure.pdf
- Design and Application of a CMOS Imager Based Barcode Recognition System in Enterprise SSD Traceability System.pdf
- Efficient and Low-Cost High Speed Electrolytic Belt Stripping Chemical Solution.pdf
- Error Proofing Detection of Wire Entanglement During Wirebonding - Stop the Risk on WRWR Resolution.pdf
- Increasing Overall Tool Availability - Costless Investment Through Wafer Sourcing and Recycling.pdf
- Influence of Blade Usage in the Occurrence of SN Metal Burrsduring Full Cut Singulation of Wettable Flank QFN Package.pdf
- Optimization of Laser Marking Parameters for Wettable Flank QFN Package Through Response Surface Methodology.pdf
- Package Integrity Improvement for Dual Pad Clip Bond Packages.pdf
- Plating Thickness SPC CPK Improvement - A New Way to Strategize SPC.pdf
- Reduction in Wafer Residual Resist Thru Effective Wafer Spin Speed Augmentation.pdf
Failure Analysis and Reliability
Best Paper Track for Failure Analysis and Reliability – Analog Devices, Inc.
- ADVANCING FAILURE ANALYSIS THROUGH AUTO-DEFECT IMAGING FOR BIG DATA ANALYTICS.pdf
- Die Crack Resolution Using Fractography and Mechanical Stress Simulation.pdf
- DIE CRACK SIMULATION - UNDERSTANDING DIE WEAKNESS IN THE PRESENCE OF DIE ATTACH SOLDER VOIDIN CLIP BOND DEVICES.pdf
- FASTER SETUP TIME USING THE CONVERTER BENCH SYSTEM USING LABVIEW AND NI-6363.pdf
- Fault Localization of Temperature-Dependent Digital Circuit Functional Failures Utilizing the Scan-based Bench Testing and the DALS .pdf
- NON-DESTRUCTIVE PACKAGE-LEVEL FAULT LOCALIZATION IN CHIP SCALE PACKAGE BALL GRID ARRAY (CSP-BGA) DEVICES.pdf
- PHYSICAL FAILURE ANALYSIS OF HDCP-RELATED FAILURE INAHIGH SPEED SERDES.pdf
- REDEFINED IMC COVERAGE METHODOLOGY FOR PCC-CU WIRES BONDED TO ALUMINUM PAD.pdf
- SELECTIVE BACKSIDE DECAPSULATION ON MULTIPLE PADDLED DEVICES WITH DOWNBONDS1.pdf
- UTILIZATION OF ELITE SYSTEM FOR PRECISE FAULT LOCALIZATION OF FUNCTIONAL FAILING INTEGRATED CIRCUIT (IC).pdf
Product
Best Paper Track for Product – STMicroelectronics, Inc.
THERMAL EXPANSION SIMULATION OF SINGULATED MOLDED SUBSTRATE THROUGH FINITE ELEMENT ANALYSIS
Quality System
Best Paper Track for Quality Systems – onsemi-Carmona
- EMPOWERING LEAN PRINCIPLES IN AUTOMOTIVE MANUFACTURING INDUSTRY - ADDRESSING THE CHALLENGES AND CAPTURING BEST PRACTICES.pdf
- HANDS-FREE TURNSTILE
- IMPROVEMENT OF LOW LEVEL EPOXY SENSING AND ELIMINATION OF HUMAN INTRUSION.pdf
- LASER CUTTING MACHINE IMPROVEMENT AND DEFECT REDUCTION THROUGH VACUUM OPTIMIZATION.pdf
- MACHINE QUALIFICATION - SETTING A NEW STANDARD.pdf
- MANAGING SCRAP - A BENCHMARK APPROACH.pdf
- REDUCTION OF QC FAILURES RELATED TOELECTRICALLY-INDUCED PHYSICAL DAMAGE.pdf
- SURFACE CONTAMINATION REDUCTION ON CLEAN BOOTH AREA.pdf
- The Flash Back - Resolving Customer Power Pad Mounting Issues through Flash Prevention and Enabling Auto Back Side Inspection.pdf
Support System
Best Paper Track for Support Systems – P.IMES Corporation
- 31st ANTS_PROCESS CONTROL AND CERTIFICATION_REDEFINING ORDINARY TO EXTRAORDINARY SOLUTIONS.pdf
- 31st ANTS_TOWARDS THE FUTURE OF DATA SCIENCE RESTRUCTURING THE UNSTRUCTURED LEGACY SOLUTIONS.pdf
- DIGITAL PRESSURE GAUGE READING USING TRANSFER LEARNING.pdf
- INNOVATIONOF ENERGY METERS THROUGHACCURATE MONITORINGON ENERGY CONSUMPTIONOF END-USER TO CREATE ENERGY EFFICIENCY AND CONSERVATION PROGRAMS.pdf
- Uninterruptible Supply of Compressed Dry Air using Liquid Nitrogen.pdf
Test Manufacturing
♦ Best Overall Industry Paper – Analog Devices, Inc.
AUTOMATED WAFER MAP CREATION FROM FINAL TEST DATA AND PATTERN CLASSIFICATION USING MACHINE LEARNING
- A SIMPLE METHOD FOF CATCHING INTERMITTENT FAILURES.pdf
- DEMYSTIFIED THROUGH PATTERNS - PROBLEM-SOLVING USING DATA ANALYSIS, DETECTION, PREDICTION, & PREVENTION.pdf
- ELIMINATION OF TEST ESCAPE ISSUES ON TEST HANDLER.pdf
- ENTANGLED UNITS’ PREVENTION - RASCO SIP TEST HANDLER HOPPER DESIGN .pdf
- EOS PREVENTION ADVOCACY - IN LINE TEST METHOD FOR CAPTURING DEFECTIVE BYPASS CAPACITORS IN TEST PERFORMANCE BOARDS THROUGH AN AUTOMATED TEST EQUIPMENT.pdf
- FINDING THESWEET SPOT - A DEEP-DIVE ANALYSIS ON NON-GENUINELOAD BOARD CHECK FAILS.pdf
- GREEN LASER - THE BREAKTHROUGH BRANDING TECHNOLOGY FOR 5G PRODUCTS.pdf
- INTELLIGENT THERMAL CONTROL & SOAK TIME REDUCTION, A SOLUTION TO IMPROVE CAPACITY AND UTILIZATION.pdf
- LIFTED LEADS ELIMINATION AT FINAL TEST USING RELIABILITYCENTEREDMAINTENANCE METHODOLOGY.pdf
- MACHINE LEARNING - FEATURE SELECTION FROM HIGH DIMENSIONAL DATA FOR EARLY DETECTION OF FAILURES ON SEMICONDUCTOR DEVICES.pdf
- MYSTERY UNLOCKED, DIAPHRAGM PRESSURE - THE KEY TO RESOLVE CONTACT SENSITIVITY.pdf
- PCB design board simulation Discovery - Eradicating Unwanted Voltage through Efficient Filter Lay-out.pdf
- RF Noise Reduction thru Test Signal Averaging.pdf
- Validation of Pressure Sensitive Adhesive asAlternative Accelerometer Attachment on Aluminum Alloy Jig under Vibration Test.pdf
- VALIDATION TO VERIFICATION(V2V) - AN ULTRAFLEX TOTEST VECTOR TRANSLATOR
2023
Assembly Manufacturing
Best Paper Track for Assembly Manufacturing – Nexperia Philippines, Inc.
DEVELOPMENT AND CHALLENGES OF HIGH FEED SPEED WAFER DICING PROCESS FOR SILICON WAFERS
- Adapting Lean & Advance Manufacturing Technology at OSS INS Assembly Line_FINAL.pdf
- ADAS_MULTI-FUNCTION_LIDAR_SCRAP_ELIMINATION.pdf
- AUGMENTING CAPABILITY OF BOTTLENECK PROCESS AT CCU BACK-END ASSEMBLY.pdf
- BRIDGE PICK TOOL MODIFICATION ON DACA MACHINES FOR TILTED CLIP AND CRACK DIE REJECT REDUCTION.pdf
- ELEVATING PROCESS CONTROL AND CERTIFICATION UTILIZING ALID.pdf
- Eliminating Inductive Kickback by Using Diode as Surge Suppressor for BSAVI Machines.pdf
- Eliminating Short Circuit on Plc Signals Through the Use of Wire Jumper for FAVI Machines.pdf
- Embracing Evolution Photoresist Stripping 2.0.pdf
- Excessive Flashing Reduction on Plad Single-Die Bi-rectional Devices Thru Stack Height Analysis.pdf
- FORGING THE FOUNDATION OF LIGHTS OUT STRATEGY FOR INSPECTION BY SUSTAINING PACKAGE EXCELLENCE THROUGH SMARTT SAMPLING.pdf
- IMPACT OF LOW TEMPERATURE MOLD CLEANER CONDITIONER ON MOLD PROCESS.pdf
- JLP CABLE ASSEMBLY AND HARNESS CYCLE TIME REDUCTION THROUGH AUTOMATIC CONTINUITY TESTING.pdf
- LINE BALANCING IN SAS LINE 6 THROUGH CYCLE TIME OPTIMIZATION.pdf
- PD• 6NH3• 2RX NEW PALLADIUM ELECTROLYTE FORMULATION ENABLING THINNER METAL OPTIMUM DEPOSITION.pdf
- PNP Head Matrix II Asynchronous Pick Body Stroke; Causes, Effects, and Solutions.pdf
- Prevention of Servomotor Burn By Replacing Motor With Higher Torque.pdf
- REDUCING ELECTRICAL TEST OUTLIERS THROUGH SILVER SINTERING DIE ATTACH METHOD OPTIMIZATION.pdf
- REDUCTION OF CRUMPLED STRIPS OCCURRENCE FOR SOHED AT MECO-01.pdf
- REDUCTION OF LOW VACUUM PRESSURE READING ON VACUUM PROCESSOR.pdf
- REDUCTION OF PROCESS CYCLE TIME THROUGH THE INNOVATION OF MANUAL OR SEMI-AUTO JIGS & FIXTURES D.I.A.D.O.I. BASED APPROACH.pdf
- SAWING PROCESS STREAMLINING BY FULL CUT INTRODUCTION ON ULTRA THIN WAFERS.pdf
- SEMI-AUTOMATIC CRIMPING MACHINE SET-UP CYCLE TIME IMPROVEMENT THROUGH STANDARDIZATION OF PARAMETER SELECTION AND KITTING PROCESS.pdf
- SOT227 PRE-FORM FINAL FORM POKA-YOKE FOR TOOL PARTS BREAKAGE.pdf
- SURFACE IONIZATION EFFECT OF MIXED GAS Ar+H2 PLASMA.pdf
- SUSTAINABLE DEVELOPMENT A GUIDE TO PLATING COST EFFICIENCY.pdf
- ULTRA SHORT PULSE (USP) LASER GROOVING A NEW SAWING TECHNIQUE TO ADDRESS DIE STRENGTH ISSUES IN THINNER PACKAGES.pdf
- WAFER SAW PROCESS IMPROVEMENT THROUGH LASER GROOVE KERF CHECK OPTIMIZATION.pdf
- WIRELESS DETECTION OF ELECTROSTATIC DISCHARGE (ESD) EVENT THROUGH.pdf
Failure Analysis and Reliability
Best Paper Track for Failure Analysis and Reliability – Integrated Micro-Electronics, Inc.
DELAMINATION ANALYSIS OF AN ALN (DIRECT BOND COPPER SUBSTRATE) USING FINITE ELEMENT ANALYSIS (FEA)
- Conductive Die Attach Delamnination on C19210.pdf
- DELAMINATION ANALYSIS OF AN ALN (DIRECT BOND COPPER SUBSTRATE) USING FINITE ELEMENT ANALYSIS (FEA) - BA, BM, CVC.pdf
- Elimination of Peel Off UV Adhesive on UV Shoulder.pdf
- Fractographic Analysis of Die Crack Simulated Under Different Fracturing Conditions.pdf
- HIGHLY ACCELERATED LIFE TEST AND ENVIRONMENTAL-3 ORT OPTIMIZATION_GSumalinog.pdf
- Impact of Die Attach Film Elastic Modulus on Adhesion and Package Reliability.pdf
- OUTRIGHT DETECTION OF DR TO DIA ASSY LEVEL RELIABILITY FAILURES_DPatarata.pdf
- Risk of Bulk Containers for ESD Sensitive Devices.pdf
- Validation of Pressure Sensitive Adhesive Naredo-Ebero-Diwa.pdf
Product
Best Paper Track for Product – Ampleon Philippines, Inc.
- ADDRESSING CRITICAL WIREBOND LOOP CHALLENGES ON AUTOMOTIVE MEMS DEVICE WITH STACKED-DICE CONFIGURATION.pdf
- Control and Simulation of electrolytic migration_fullpaper.pdf
- Deep-Dive Investigation on Pad Discoloration Issue in Optical Sensing Device.pdf
- Introduction of Descaling for the Improvement of Half Cut Singulation Process of Wettable Flank QFN Packages.pdf
- Optimal Design of SiC MOSFET Half Bridge Power Module for 200A Current Rating based on Electrothermal Simulation.pdf
- Solder-induced HAST Failures.pdf
Quality System
Best Paper Track for Quality Systems – STMicroelectronics, Inc.
- CACB RASCO JUPITER 2 COMMITTED MANUFACTURING CAPACITY (CMC) INSERTION IMPROVEMENT.pdf
- CHALLENGING THE PROCESS AND MATERIAL CHARACTERISTIC TO ADDRESS THE HIGH EPOXY USAGE CONSUMPTION OF VI POWER PACKAGES.pdf
- COMPARATIVE STUDY OF TWO SCANNING TECHNIQUES IN AUTOMATIC SIDE VISUAL INSPECTION OF WETTABLE FLANK QFN PACKAGES.pdf
- Device “T” Electrical Yield Improvement.pdf
- DEVISING VARIATION REDUCTION TECHNIQUES FROM STATISTICAL PROCESS CONTROL (SPC) SIGNALS TO ACHIEVE WIREBOND PROCESS STABILITY.pdf
- ELIMINATION OF BROKEN WIRE AT HEEL FOR SSOP PACKAGE.pdf
- ELIMINATION OF CONDUCTIVE DIE ATTACH FILM INTERFACIAL DELAMINATION DUE TO INTRINSIC HIGH ASPECT RATIO ULTRATHIN HIGH DIE BOW LEVEL.pdf
- Elimination of Mixed Device_onsemi Car_Eugenio.pdf
- Elimination of PCBA Related Functional Defects on Amber or Opal Machine by Improving M03-A13-00 Jadeback Connector Assembly using Sold.pdf
- ELIMINATION OF RBFA DISTURBED WIRE OCCURRENCE.pdf
- FT Guardband A Structural Solution Control in Screening Lots for Test.pdf
- IMPROVED MOLD TOOL DESIGN ROBUSTNESS THROUGH THE DMAIC PROCESS (Nexperia_WPena)
- LEADTIME IMPROVEMENT – BALANCED ARMATURE AGING REDUCTION_MPTorralba.pdf
- NETWORK SYSTEMS SOLUTIONS INTEGRATION TO ELIMINATE MISSING OR INCOMPLETE SUPPLIER KEY DATA USED FOR COMPONENT TRACEABILITY.pdf
- OVER REJECTION DOWNTIME REDUCTION THROUGH MAGNETIZED CLEANING BRUSH.pdf
- Reduction of 3rd Opt Yield Off and Fallen Units_Technical Paper Template.pdf
- REDUCTION OF DENTS THROUGH INSTALLATION OF EJECTOR PINS ON COMPOUND DIE.pdf
- Reduction of DIGHSB Board Failure on Device “S”.pdf
- Reduction of Module 2 Detape Rate.pdf
- REDUCTION OF OVER REJECTION AT 5 SIDES VISION OF TEST & TAPE MACHINES.pdf
- REDUCTION OF STRAY WIRE RBFA INCIDENT AT WIRE BOND.pdf
- TESTING PROCESS ROBUSTNESS ELIMINATION OF POTENTIAL MIXING CUSTOMER COMPLAIN THROUGH ERROR PROOFING METHODOLOGY.pdf
- Three_Way_Test_Detection_Enhancement_Paper.pdf
- VALUE STREAM MAPPING (VSM) ON MAP AVAILABILITY AT INCOMING QUALITY CONTROL (IQC) PHASE A LEAN APPROACH TO LEAD TIME REDUCTION AND MANUFACTURING EFFICIENCY IMPROVEMENT.pdf
Support System
Best Paper Track for Support Systems – Knowles Electronics Philippines
DATA ANALYTICS THROUGH FAILURE CODE TRIGGER AND MULTI-LEVEL SCORECARD
- AUTOMOLD CELL CONTROLLER AUTOMATION OF MOLD MACHINES TO REDUCE QUALITY ISSUES.pdf
- DATA ANALYTICS THROUGH FAILURE CODE TRIGGER AND MULTI-LEVEL SCORECARD.pdf
- Elimination of External and Internal Findings_onsemi Car_Gabriel.pdf
- IMPROVEMENT OF PRODUCT RELEASE CHANGE ORDER (PRCO) PROCESS THROUGH PIMES SYSTEM INTEGRATION AND DIGITIZATION.pdf
- REUSING OF REVERSE OSMOSIS (RO) REJECT WATER THROUGH CREATION OF WATER HARVESTING SYSTEM TO CONSERVE WATER
Test Manufacturing
♦ Best Overall Industry Paper – Analog Devices General Trias, Inc.
TEST EQUIPMENT INTELLIGENT EDGE SOLUTION FOR PACKAGE CRACK PREVENTION
Best Paper Track for Test Manufacturing – onsemi Carmona
ONE-SHOT PPE DETECTION FOR BAKE OVENS USING RESNET50 CONVOLUTIONAL NEURAL NETWORK
- 3D SIMULATION SOFTWARE EFFECTIVE TOOL ON REDESIGNING CLAMPING MECHANISM FOR DAMAGED STRIP ELIMINATION.pdf
- AN INNOVATIVE SOLUTION TO ELIMINATE MANUAL HANDLING WITH THE INTRODUCTION OF AUTO FLIPPER TECHNOLOGY FOR DEAD BUG MODULE.pdf
- ELIMINATION OF MIXING OF TESTED AND UNTESTED UNITS AT SENSOR FINAL TEST USING MECHANICAL ERROR-PROOFING_32nd ANTS_Technical Paper Template_V00_20230623.pdf
- IMPROVING CONTACT RELIABILITY THRU RCM APPROACH.pdf
- Issue Resolution Cycle Time Reduction in Test Escape and Mixing Events using Jira.pdf
- Latch-up Tester Hidden Threats Beneath 100V 1A_final.pdf
- QC FAILURE ELIMINATION PREDICTING CURRENT SENSE TEST FAILURES THROUGH LINEAR REGRESSION.pdf
- TEST HANDLER JAM REDUCTION AN IN-DEPTH ROOT-CAUSE ANALYSIS APPROACH ON UP DOWN MOTOR ASSEMBLY FAILURE USING RELIABILITY CENTERED MAINTENANCE (RCM) METHODOLOGY.pdf
- Tester Efficiency Improvement
2024
Academe
Best Paper Track for Academe – FAITH Colleges (First Asia Institute of Technology and Humanities)
IOT-Driven Power Monitoring and Centralized Control System for Energy Conservation
- Detection of Violators of Garbage Disposal.pdf
- GESTULEARN HAND TRACKING AND GESTURE RECOGNITION TECHNOLOGY FOR ASSISTIVE TEACHING IN SPECIAL EDUCATION.pdf
- Real-Time-Airconditioning-Unit-Monitoring-System-with-Analytics-for-Predictive-Maintenance.pdf
- SMART WASTE MANAGEMENT IN POULTRY FARMS MONITORING AND CONTROLLING AMMONIA AND FLY INFESTATIONS.pdf
Assembly Manufacturing
♦ Best Overall Industry Paper – Texas Instruments Philippines, Inc. – Clark
Enabling Zero Chemistry Maintenance Thru a Novel Universal Analyzer Powered by EODT Neural Framework
Best Paper Track for Assembly Manufacturing – onsemi Carmona
- ACHIEVING OPTIMAL PROCESS EFFICIENCY-AUTOMATED SOLUTIONS FOR PRODUCT SAMPLING AND TOOL STATE CHANGE.pdf
- APPLICATION OF PACKAGE STRESS REDUCTION STUDY REENGINEERING OF CHUTE PUSHER SPRING HOLDER ASSEMBLY FOR CLIPBONDED HANMI TRIM AND FORM MACHINES.pdf
- Arduino UNO and Design Thinking Empowers Tape Curing Process Control Advancements.pdf
- AUTOMATED CYCLE TIME AND PROCESS BOTTLENECK ANALYSIS THROUGH INTEGRATION OF AI INTO EXCEL'S MACRO PROGRAMMING.pdf
- Boosting E88_RascoDT_Throughput_A Lean Approach to Machine Utilization.pdf
- CURRENT SENSOR CAPACITY IMPROVEMENT.pdf
- DIE ATTACH CHANGE IN EPOXY WEIGHT FOR CONSUMPTION REDUCTION.pdf
- Effective way of extracting weight of composite materials.pdf
- ELIMINATION OF MANUAL TEMPERATURE & RELATIVE HUMIDITY MONITORING THROUGH AUTOMATIC DATA LOGGER & REAL-TIME NOTIFICATION SYSTEM.pdf
- Enhancing Semiconductor Fabrication Through Operational Optimization and Cost-Efficiency through N2 removal strategies.pdf
- INTELLIGENT VIDEO ANALYTICS FOR IMPROVING MAN-TO-MACHINE-RATIO (MMR) IN AN ASSEMBLY LINE.pdf
- Leading Indicator Detection through SPC input Variable Controls S.Novio.pdf
- LENS GLUE DISPENSE ATTACH IMPROVEMENT THROUGH FLUID PRESSURE OPTIMIZATION TO COMPENSATE HIGHER VISCOSITY AND TO MEET REQUIRED PRODUCTION OUTPUT.pdf
- Optimizing Cost Efficiency - Product Cost Reduction for Product X BAs_MSorallo.pdf
- PREVENTION OF MOTOR AND SENSOR ASSEMBLY FAILURES FLOW-OUT BY INTRODUCING IMPROVISED TESTING EQUIPMENT.pdf
- PROCESS SIMPLIFICATION THROUGH ELIMINATION OF PRE-CUT, COVERLAY AND DE-TAPE PROCESS FOR MEMS INSTRIP PACKAGES.pdf
- REDUCTION OF CYCLE TIME THROUGH ELIMINATION OF SINK MARK BY IMPROVING THE MOLD DESIGN.pdf
- Scalable Platform Approach for Analyzing Change in Manufacturing Data.pdf
- Streamlining Quality, Efficient Process, Batch Lot Optimization Through Value Stream Mapping and Lean Sigma with Elite Inline Repair System.pdf
- SYSTEMIC APPROACH ON ROOT CAUSE ANALYSIS OF BANDGAP FAILURE FOR YIELD IMPROVEMENT OF QFN DEVICES.pdf
- THE EFFECTIVE USE OF TRIZ METHODOLOGY IN THE OPTIMIZATION OF THE TERMINAL SOLDERING PROCESS OF BALANCED ARMATURES.pdf
- TRANSFORMING PAPER-BASED WORK INSTRUCTIONS INTO ANIMATED CAD SIMULATIONS WITH AI-GENERATED CAPTIONS.pdf
- Unsupervised Change Detection for Within-Run Manufacturing Data.pdf
- VIRTUAL PARTS TRACKING USING AUGMENTED REALITY (AR) IN AN ASSEMBLY LINE.pdf
- WAFER TOP METALLIZATION ANOMALY DETECTION at 3RD OPT 3.pdf
- WIREBOND MONITORING SIMPLIFICATION AND CYCLE TIME IMPROVEMENT BY ELIMINATION OF NON-VALUE ADDED ACTIVITIES.pdf
Failure Analysis and Reliability
Best Paper Track for Failure Analysis and Reliability – Toshiba Information Equipment (Phils.), Inc.
Deep Learning Application for Automated Classification of Particle Morphology In Root Cause Analysis
- A STUDY ON THE EFFECT OF BLACK SILICON DIE ON THE INFRARED IMAGING.pdf
- CHARACTERIZATION OF EPOXY GLUE ADHESION PERFORMANCE ON GOLD PLATED COPPER SUBSTRATES.pdf
- Characterization of Protective Films_Abayari Cueva Patrocenio_Manuscript.pdf
- DEFINING THE DIE ATTACH SINGLE VOID CRITERIA ON A GALLIUM NITRIDE (GaN) RF POWER TRANSISTOR IN AN AIR CAVITY CERAMIC (ACC) PACKAGING.pdf
- Effective Failure Analysis Approach in Uncovering Gate-to-Drain Source Tungsten Spur Fabrication Defect.pdf
- Exploring Failure Distribution Plots for Predictive Lifetime Analysis in the Qualification of Silver Sinter Die Attach Material in Air Cavity Package.pdf
- FAULT TREE ANALYSIS OF PNP HEAD LINEAR MOVEMENT FAILURE ON X-PITCH ASSEMBLY.pdf
- FINDING THE DIE CONFIGURATION THAT CAN OVERCOME MECHANICAL ASSEMBLY STRESSES USING LABORATORY SCALE SIMULATION SET UP.pdf
- FINITE ELEMENT ANALYSIS ON WIRE BOND BREAK DURING TC AND PTC EVALUATING ENCAPSULANT MATERIAL CHANGE AS A POTENTIAL SOLUTION.pdf
- FRACTAL GEOMETRY, IMAGE ANALYSIS & THERMAL PROFILING v2.pdf
- High Precision Selective Backside Decapsulation Technique_onsemi Carmona.pdf
- Optimizing Rel Quals of Balanced Armatures - Acc Test Conditions_GSumalinog.pdf
- Pre-EMC Testing in ATC versus an EMC Test Laboratory.pdf
- Viability of Plasma Cleaning_33rd ANTS Technical Paper_rev01.pdf
Product
Best Paper Track for Product – Ampleon Philippines, Inc.
- Chem Selection in UV-Cured Adhesives for Drive Rod Bonding of BAs_DPatarata.pdf
- Comparative Performance Evaluation of Copper Wire Compositions_onsemi Carmona.pdf
- ETCHED TO STAMPED LEADFRAMES AS A COST-EFFECTIVE SOLUTION TO COPPER LEADFRAME SUPPLY_r2.pdf
- Harmonization of DC Thermal Resistance Settings and Limits of RF Power Transistors.pdf
- SILVER SINTER MATERIAL DISPENSE OPTIMIZATION ELIMINATION OF SINTERING VOIDS DEFECT FORMATION IN GALLIUM NITRIDE DIE ATTACH.pdf
- SILVER SINTERING DIE ATTACH GALLIUM NITRIDE DIE TECHNOLOGY PACKAGING SOLUTION AND ALTERNATIVE TO EUTECTIC GOLD-TIN (AuSn) DIE ATTACH.pdf
- STRATEGIC DEPLOYMENT OF EFFECTIVE AND EFFICIENT METHODOLOGICAL CONTROLS OF FOREIGN MATERIAL INTERFERENCE IN WAFER-LEVEL 1K MANUFACTURING CLEANROOM ENVIRONMENT.pdf
- THERMAL STABILITY ASSESSMENT OF STANDARD & REDUCED Ni(Co)-Pd-Au METALLIZATION THICKNESS ON Cu-Mo70Cu-Cu HEATSPREADERS THROUGH SURFACE CHARACTERIZATION.pdf
- WAFER RECONSTRUCTION PROCESS – A BREAKTHROUGH TECHNOLOGY SOLUTIONS EMPLOYED TO TECHNICAL DIFFUSER WAFER PREPARATORY MANUFACTURING.pdf
- WAFER SAW PROCESS CHARACTERIZATION OF GALLIUM NITRIDE (GaN) WAFER TECHNOLOGY.pdf
Quality Systems
Best Paper Track for Quality Systems – Western Digital Corporation
- CHALLENGE TO ERROR PROOFING AUTOMATED INSPECTION SOLUTIONS TO EMBEDDED COSMETIC DEFECTS ON OPTICAL DIFFUSER WAFER USING HIGH RESOLUTION CHROMA EQUIPMENT.pdf
- CHALLENGING CURRENT CUSTOMER REQUIREMENT OF CHANGING PROCESS _A SIX SIGMA PROJECT REDUCTION OF IN-PROCESS DEFECT RATE IN SOLDER PASTE PRINTING PROCESS.pdf
- ELECTRONIC MEASUREMENT SYSTEM ANALYSIS.pdf
- ELIMINATION OF DAMAGE CARRIER TAPE FOR DFN8 2X2 PACKAGE IN PICKER MACHINE.pdf
- ELIMINATION OF LIFTED BALL BOND ABNROMALITY ON SQFP PACKAGE.pdf
- EMBARKING AN INTEGRAL YIELD OPTIMIZATION JOURNEY THROUGH TECHNICAL RESEARCH UNCOVERING INNOVATION AND OPPORTUNITIES AT MIT WAFER RECONSTRUCTION PROCESS.pdf
- ENHANCED AUTOMATED VISUAL INSPECTION MANAGEMENT FOR QUALITY CONTROL AUTOMATIC DEFECT CLASSIFICATION (ADC) Technical Paper Template.pdf
- ENSURING OPERATOR'S SAFETY DURING SPOTWELDING OF FRAME R 7160 THROUGH THE FABRICATION OF A WELDING JIG.pdf
- FAILURE ANALYSIS OF PICK-AND-PLACE'S BRAKE PROBLEM THROUGH MULTIFACTORIAL EXPERIMENTS.pdf
- HARD STAIN PPM REDUCTION IN POTTING STATION THROUGH EFFECTIVE AND ROBUST DESIGN OF TAPE TRACK COVER.pdf
- INNOVATION AND INCLUSION OF POU DESICCANT DRYER TECHNOLOGY TO ELIMINATE PAD DISCOLORATION CAUSED BY INTERACTION OF CDA MOISTURE TO METALLIC LGA PADS.pdf
- LEADFRAME TAPE DE-REEL PREVENTION AT WIREBOND MACHINE THROUGH SENSOR INTEGRATION.pdf
- MODEL G & H SOFTWARE MALFUNCTION RESHIP REDUCTION.pdf
- Model S Yield Improvement Through Failed Adjust Reduction.pdf
- PHONE POWER RESHIP REDUCTION FOR PHONE 3 MODEL.pdf
- PROBE DAMAGE REDUCTION USING KAIZEN METHODOLOGY.pdf
- REDUCTION OF DENTS DUE TO FLOATING SCRAP THROUGH INSTALLATION OF COUNTERBORE TYPE LOWER DIE CUTTING INSERT.pdf
- REDUCTION OF IGBT SIDE WALL CRACK.pdf
- REDUCTION OF KELVIN CHECK FAILURE OF DEVICE A AT QFN TES.pdf
- REDUCTION OF MACHINE FAILURE THROUGH ERROR PROOFING METHODOLOGY.pdf
- REDUCTION OF OVER REJECTION AT MARKING, ORIENTATION, AND PACKAGE (MOP) VISION INSPECTION OF DEVICE X.pdf
- REDUCTION_OF_NON-STICK_ON_LEAD_ON_CU_LEAD_FRAME_WITH_AG_SPOT.pdf
- Smart Manufacturing_Integrating Factory Look for Efficiency and Innovation
Support Systems
Best Paper Track for Support Systems – onsemi Carmona
- Data Analytics Through Automated Z-Score Diagnostic.pdf
- Efficient Shuttle Operations.pdf
- Natural Language Processing Enabled Natural Calamity Proactive Crisis Management.pdf
- Start-up Checklist Migration to Universal Data Collection.pdf
- UNLOCKING INSIGHTS FROM MULTIMODAL DATA ADVANCED DATA ANALYTICS FOR COMPLEX DATA SOURCES AND PROCESSING.pdf
- Wafer Probe Equipment and Analog Hardware Maintenance.pdf
Test Manufacturing
Best Paper Track for Test Manufacturing – Western Digital Corporation
Tester Anomaly Detection with Machine Learning Model Prediction
- ACCELERATING TEST CAPACITY THROUGH SELECTIVE POWER REGULATION AND PULSE SETTINGS OPTIMIZATION.pdf
- ATE POWER SUPPLY DELTA AUTOMATION - THE POWER OF PREDICTING TESTER SHUTDOWNS.pdf
- BEST TOOL MATCHING METHODOLOGY.pdf
- CDSEM Automated Inspection and Defects Classification.pdf
- COUNT TRIANGULATION SYSTEM THAT SUBSTANTIATES TEST COUNT FROM TESTER, HANDLER, AND PHYSICAL UNIT VIA DATALOG, API COMMAND AND OTSR, TO TRAP UNIT MIXING IN SEMICONDUCTOR FINAL TEST MANUFACTURING.pdf
- DEVICE TEST TRACEABILITY AN ENHANCED APPROACH FOR UNIT LEVEL TRACEABILITY IN FINAL TEST.pdf
- ELEVATING EFFICIENCY- KAKAROT SUPER GUI'S JOURNEY TOWARDS ENHANCED PRODUCTIVITY.pdf
- EMPLOYING AUTOMATION OF DIRECT CURRENT RESISTANCE TESTING UTILIZING EG PROBER ON RECONSTRUCTED WAFERS FOR A COMPREHENSIVE SOLUTION OF BROKEN TRACE DETECTION AT DIE-LEVEL CIRCUITRY.pdf
- Final Test Data Checker (FTDC) A SYSTEM-BASED APPROACH ON DETECTING A POTENTIAL DEVICE MIXING ISSUE AT FINAL TEST 2 2.pdf
- MSOP Handler PPJ Improvement Using BTM Methodology.pdf
- PROBE CONTACT FORCE_ SIGNIFICANT FACTOR IN REDUCING CONTACT.pdf
- REVOLUTIONIZING MAINTENANCE EFFICIENCY - ATE SYSTEM SMART TOOL.pdf
- SMART FACTORY OPTION POST TEST SYSTEM-BASED PROCESS CONTROL (SPC) SOLUTIONS.pdf
- Test_Using Setup Parametric to Identify and Resolve Bad Sites_onsemi Carmona.pdf
2025
Academe
Best Paper Track for Academe – FAITH Colleges
Authors: Jafeth C. Estocado, Jan Carlo A. Magpantay, Joyce Ann P. Precilla
Assembly Manufacturing
Best Paper Track for Assembly Manufacturing – onsemi Carmona
Author: Jorell D. Pelingo
- BRINGING-THE-FACTORY-TO-LIFE-A-3D-DIGITAL-TWIN-FOR-SMARTER-SAFER-AND-SCALABLE-OPERATIONS
- SMART-MANUFACTURING-INTEGRATING-IIOT-FOR-HIGH-PRESSURE-WASHING
- ANTS_ADVANCED-CONDITIONING-TECHNIQUES-FOR-FIXED-ABRASIVE-LAPPING-FILMS-USING-CERAMIC-RINGS
- ANTS_AUTOMATED-ALARM-INTEGRATION-FOR-CLOG-DETECTION-IN-POLYIMIDE-COATER-CLEANING-STAGES
- ANTS_BLADE MODIFICATION
- ANTS_EFFICIENT MES LOT-MOVEMENT VIA INTELLIGENT SYSTEM
- ANTS_ENHANCING ATS646LSG-T CAPACITY THROUGH AUTOMATION
- ENHANCING-DIE-CLEANING-EFFICIENCY-WITH-AUTONOMOUS-VACUUM-TRIGGER-IN-TRIM-FORM-MACHINES
- ENHANCING-QUALITY-AND-EFFICIENCY-SCADA-RTC-SPC-ENGINE
- HOST CONTROLLED LITHOGRAPHY
- IIOT-BASED AUTOMATION ANNEALING OVEN
- IMPROVING-THE-DELAMINATION-RESISTANCE-BETWEEN-DIE-ATTACH-MATERIAL-AND-LEAD-FRAME-PADDLE
- INTEGRATION LINE
- LAPPING PLATE ALLOY_CHATERIZATION OF SNBI RATIO
- LASER JIG DESIGN IMPROVEMENT
- LOW-COST MODULAR COLLABORATIVE ROBOT INTEGRATION
- _NEXPERIA-PACKAGE_ROBUSTNESS_ENHANCEMENT_ASEMEP_2025
- NEXPERIA_ARCHERFISH RCM
- OPTIMIZING ION MILLING PROCESS USING APC
- PACKAGE MINIATURIZATION_BAYASEN
- PREDICTIVE-TESTING-FOR-LONGEVITY-EXTENDING-SHELF-LIFE
- ANTS_RESOLVING-THE-METAL-SPUTTERING-ISSUE-OF-A-HENE-LASER
- REVOLUTIONIZING MICROELECTRONICS
- SMART-ERROR-PROOFING-INTELLIGENT-DETECTION-OF-PUPARSET-TESTER
- SMART-VISION-ARCHITECTURE-FOR-AUTOMATING-INSPECTION
- SOLVENT SMART AUTOMATION
- TECHNICAL-PAPER-_ULT_20250703
- TECHNICAL PAPER SIC HIGH SPEED DICING
Failure Analysis and Reliability
♦ Best Overall Industry Paper – Ampleon Philippines, Inc.
Authors: Marty Lorgino D. Pulutan, Kimberly P. Jardin , Renald L. Dechino
Best Paper Track for Failure Analysis and Reliability – Ampleon Philippines, Inc.
Authors: Kimberly P. Jardin, Donald C. Locana, Rogielyn A. Formento
Product
Best Paper Track for Product – Ampleon Philippines, Inc.
Authors: Gerry Alvano, Melissa Angelica Camacho, Christopher Cosme, Bongbong Mendoza
DEFECT PROOFING TRANSISTOR PACKAGES THROUGH MULTIPHASE-NASTRAN LEADFRAME DESIGN SIMULATOR
- TECHNICAL-PAPER-9-DEFECT-PROOFING-DESIGNS
- ACHIEVING-MEMS-OPTIMUM-TEST-RELIABILITY-PERFORMANCE
- ANTS_ELIMINATION-OF-WIRE-SHORTING-DEFECT-ON-MEMS-DEVICE
- MITIGATING-MOLD-FLASH-ON-OVER-MOLDED-PLASTIC-OMP-PACKAGES
- OPTIMIZING-SEMICONDUCTOR-PERFORMANCE-PACKAGE-RESISTANCE
- SOLVING-RF-POWER-ADDED-EFFICIENCY-DEGRADATION-ISSUE
- TRAPPING EFFECT RECOVERY FOR GAN DEVICES
- ANTS_WAFER-LEVEL-PACKAGE-DEVELOPMENT-OF-FLIP-CHIP-INTERCONNECTS
- A-NOVEL-APPROACH-ON-ENABLING-STACKED-DIE-INTEGRATION
- CHARACTERIZATION-ON-THE-IMPACT-OF-DIRECT-BONDED-COPPER-SUBSTRATE-VOIDS-ON-THE-THERMAL-PERFORMANCE
- COMPARATIVE-STUDY-OF-THERMAL-RESISTANCE-IN-PURE-AND-HYBRID-AG-SINTER
- DEFINING-THE-MINIMUM-RETEST-INTERVAL-IN-GAN-DEVICES
- KNOWLES_OVERCOMING-THE-LIMITATIONS-OF-ACRYLATE-UV
- PARAMETRIC-DESIGN-OF-WIRE-PASSIVATION-THICKNESS-TO-REDUCE-OXIDATION
- THE-EFFECT-OF-NICKEL-BARRIER-PLATING-THICKNESS.
Quality Systems
Best Paper Track for Quality Systems – Ampleon Philippines, Inc.
Authors: Marty Lorgino D. Pulutan , Jerome D. Amado
- A-SIX-SIGMA-APPROACH-TO-ADDRESS-HIGH-PPM-AT-DIE-ATTACH-DUE-TO-EPOXY-RELATED-REJECTS
- AUTOCAP_A VENDING-BASED SOLUTION
- CLOSING-THE-GAP-RESOLVING-MEASUREMENT-MISMATCH-THROUGH-A-COLLABORATIVE-MEASUREMENT-SYSTEM-ANALYSIS
- COMPUTER VISION AS SENSOR
- DETECTION-AND-CHARACTERIZATION-OF-B-STAGED-ADHESIVE-MATERIAL-VARIABILITY-THROUGH-QUANTITATIVE-TACKINESS-EVALUATION
- ANTS_ENHANCING-UNIT-PER-HOUR-UPH-FOR-XDFN-1X1-PCC-WIRE-DEVICES-VIA-DOE-METHODOLOGY.pdf
- FROM-CRACKS-TO-MARKET-A-JOURNEY-TO-ELIMINATE-DIE-CRACK-ON-TURRET-HANDLER.pdf
- GOLDEN-LINE-DRIVEN-DESIGN-AND-PROCESS-SOLUTIONS-FOR-MOLD-FLASH-ELIMINATION.pdf
- ILASTIK-MACHINE-LEARNING-AI-BASED-APPROACH-FOR-AUTOMATED-QUANTIFICATION.pdf
- MEMS-MV8P-WIRE-PROXIMITY-PPM-REDUCTION.pdf
- OPTIMIZATION-OF-CHEMICAL-SOAKING.pdf
- QUALITY-TRANSFORMATION-SMART-QUALITY-AND-AUTO-HOLDING-IN-THE-ERA-OF-INDUSTRY-4.0.pdf
- REDUCING-REWORK-IN-VISUAL-INSPECTION-BY-ADDRESSING-EXCESS-RESIN-IN-DEVICE-X.pdf
- SMART-MAINTENANCE-ALERTS-ENHANCING-CLEANROOM-EFFICIENCY-WITH-WEARABLE-TECHNOLOGY.pdf
- SMART-REPAIR-SOLUTIONS-INTEGRATING-IIOT-AND-RECOMMENDATION-SYSTEMS-FOR-INDUSTRY-4.0-MANUFACTURING.pdf
- STRATEGIES-FOR-REDUCING-DELAMINATION-IN-GAN-DIE-ATTACH.pdf
- TECHNICAL-PAPER_ALIGNED-FOR-SUCCESS-THE-JOURNEY-TO-REDUCING-PACKAGE-MISALIGNMENT.pdf
- ULTRASONIC-CLEANING-INTEGRATION-IN-VAM_JDUMAGUIT_2.pdf
- UTILIZING-AUTOMATED-MANUFACTURING-EXECUTION-SYSTEM-MES-TO-REDUCE-QUALITY-ISSUES-DUE-TO-WRONG-REEL.pdf
- YIELD-ENHANCEMENT-OF-BAS-THROUGH-ADVANCED-DATA-ANALYTICS-AND-AI-INTEGRATED-RCA.pdf
Support Systems
Best Paper Track for Support Systems – Western Digital Storage Technologies (Philippines) Corporation
Authors: Kian Wooi The, Weng Chin Tang, James Gonzales
EMBEDDING AUTOMATED MACHINE LEARNING WITHIN GENERATIVE AIBASED CONVERSATIONAL SYSTEMS
- EFFECT-OF-SUPPLY-CHAIN-MANAGEMENT-STRATEGIES-AND-ORGANIZATIONAL-COMPTENCE-ON-OPERATIONAL.pdf
- MATERIAL-DATA-ANALYTICS-THROUGH-MATERIAL-CORRELATION.pdf
- REPORT-ORCHESTRATOR-GENERATIVE-AI-FRAMEWORK.pdf
- DATA INSIGHT GEN AI
- EMBEDDING-AUTOMATED-MACHINE-LEARNING-WITHIN-GENERATIVE-AI-BASED-CONVERSATIONAL-SYSTEMS.pdf
- ENHANCING-SUPPLY-CHAIN-PERFORMANCE.pdf
- FACTORY-CAPACITY-OPTIMIZATION-WITH-INTEGER-LINEAR.pdf
- FINANCIAL_OWNERSHIP_IN_SEMICONDUCTOR_OPERATIONS_GEARED_TOWARDS_AI.pdf
- HYBRID-INFERENCE-QUERY-FRAMEWORK-FOR-RAG-DRIVEN-TRUTH-PROMPT-PAIRS.pdf
- KNOWLEDGE-GATE-A-PERSONALIZED-GATEWAY-FOR-A-SECURE-AND-CUSTOM-LLM.pdf
Test Manufacturing
Best Paper Track for Test Manufacturing – Ampleon Philippines, Inc.
Authors: Kimberly P. Jardin, Roelof van der Berg, Floralyn T. Custodio, Eric G. Del Rosario
- A-SPLIT-SITE-TESTING-APPROACH-TO-MINIMIZE-CROSS-TALK-INDUCES-EEPROM-PARAMETER-FAILURES.pdf
- OPTIMIZATION-OF-2DID-MARKING-PROCESS-THROUGH-DUPLICATE-ELIMINATION.pdf
- INTELLIGENT-TEST-BRIDGE-DESIGN-FOR-SUSTAINABLE-YIELD-IMPROVEMENT-IN-AIR.pdf
- PTY-POWER-BI.pdf
- SMART-ENERGY-STRATEGY-ENHANCING-ASM-FT2026-FINAL-TEST-HANDLER.pdf
- STRIP-CONVERSION-KEY-STRATEGIES-AND-INNOVATIONS-FOR-A-FAST-TURNAROUND-IN-CLARK-QFN.pdf
- TECHNICAL-PAPER_ACHIEVING0P5_CS_ACCURACY_IN_NEXFET.pdf
- TEST_TIME_REDUCTION.pdf
- BAKE-SETTINGS-OPTIMIZATION-FOR-GAN-DFN-PACKAGE-TYPES.pdf
- DAMAGED-PACKAGE-ELIMINATION-A-STUDY-AND-ADAPTATION-OF-TOP-PACKAGE-UNIT-STOPPER-IN-FT.pdf
- GAN-CCPAK-IST-INDUCTIVE-SWITCHING-TEST-AUTOMATION.pdf
- INNOVATIVE-QUARTZ-CASSETTE-DESIGN-FOR-MINIMIZING-WAFER-BREAKAGE.pdf
- OPERATIONAL-EXCELLENCE-IN-ACTION-A-DATA-DRIVEN-APPROACH-TO-WORLD-CLASS-OEE.pdf
- OPTIMIZING-RETEST-RATES-IN-TSSOP-FOR-SUSTAINABLE-MANUFACTURING.pdf
- PULSE-TIME-OPTIMIZATION-FOR-ENHANCED-RELIABILITY-CORRELATION.pdf
- PREDICTIVE-THERMAL-CONTROL-FOR-EFFICIENT-LDMOS-BURN-IN-TESTING-IN-AI-ERA-ELECTRONICS-MANUFACTURING.pdf
SEIPI’s networking committee that continuously works on the best security professional practices, which shares a common goal amongst SEIPI members. Its vision is to provide leadership role in the design and propagation of effective security business practices and application for semiconductor and electronics industries in the Philippines.
NAME | COMPANY | NWC POSITION |
|---|---|---|
Reden Santos | Western Digital | CHAIRPERSON/NETWORKING |
Javer Valino | Ionics EMS | DEPUTY CHAIRPERSON/R&D/ROADMAP |
April Dionela | Analog Devices | TRAINING |
Jill Mallorca | onsemi Carmona | TRAINING |
John Lemuel Sevilleno | Microchip Technology Operations Corporation | TRAINING |
Sandeep Sinha | SunPower Philippines Manufacturing | R&D/ROADMAP |
Michelle Lausa | Teradyne Philippines | ADVOCACY |
Beverlyn Corino | Teradyne Philippines | ADVOCACY |
Neil Dumoran | Minebea Mitsumi | ADVOCACY |
James Ponce | Gruppo EMS | INFORMATION |
Michael Ocampo | Toshiba Information Equipment (Philippines) | INFORMATION |
Mary Grace Ebora | Aumovio | NETWORKING |
James Da Silva | Texas Instruments | NETWORKING |
Mark Sto. Domingo | Philippine Manufacturing Company of Murata | SERVICES |
Apolinario Consemino | Amkor Technology | SERVICES |
Top three (3) priorities for 2026
Training
R&D
Advocacy
Information
Networking
Service
Q1
Q2
Q3
Q4
For more information, please contact marcus.tayas@seipi.org.ph
ASLM is SEIPI’s committee in charge of facilitation movement of goods, with main lobbying efforts towards simplifying procedures in the Bureau of Customs and PEZA. Its vision is to make the Philippines the benchmark country in Asia in trade facilitation. It’s mission is to enhance the global competitiveness of the industry, through the simplification of import and export rules and regulations towards the improvement of trade facilitation thereby reducing the transit and cycle time of finished goods and cost of doing business in the Philippines.
NAME | COMPANY | NWC POSITION | |
|---|---|---|---|
Monina Dimacuha | Ionics EMS | CHAIRPERSON | |
Melanie Quiambao Lanto | Aumovio | DEPUTY CHAIRPERSON | |
Arman Malgapo | Amkor Technology | TRAINING | |
Andrea Elca | Microchip Technology Operations Corporation | TRAINING | |
Dante Hernandez | Gruppo EMS | R&D / ROADMAP | |
Clemen Khio | Teradayne | R&D / ROADMAP | |
Alvin Eusebio | onsemi | ADVOCACY | |
Eric Carasus | Integrated Micro-Electronics, Inc | ADVOCACY | |
Ariel Pablo | Analog Devices | INFORMATION | |
Wilma Gonzaga | Minebea Mitsumi | INFORMATION | |
Gilda Damayo | Texas Instruments | INFORMATION | |
Adornita Panganiban | Toshiba Information Equipment (Philippines) | NETWORKING | |
Ma. Isabel Villacorta | Philippine Manufacturing Co. of Murata | NETWORKING | |
Darlene Gutierrez | Western Digital | SERVICES | |
Wilda Calderon | SunPower Philippines Manufacturing | SERVICES | |
Fherie Gonzales | Ibiden Philippines | ADVISER | |
Jonathan Rago | Texas Instruments | Jonathan Rago |
The Networking Committees (NWCs) are attended by Directors/Senior Managers, Managers and Supervisors, to act as the platform for benchmarking and exchange of ideas. Through the NWCs, SEIPI organizes a wide variety of
training programs to strengthen the global competitiveness of the industry.
ASPA is the networking committee tasked in managing and policing ethical hiring practices within the industry as well as serving as a networking venue for best known labor relation practices and information source for the industry on other labor related matters. Its vision is to reinforce the transition of the organization to become strategic business partners (SBPs) of the semiconductor and electronics industry.
NAME | COMPANY | NWC POSITION |
|---|---|---|
Cyras Palmos | SunPower Philippines Manufacturing | CHAIRPERSON |
Rachel Encarnacion | Analog Devices | DEPUTY CHAIRPERSON |
Janette Binuya | Aumovio | TRAINING |
Randy Feliciano | Philippine Manufacturing Co. of Murata | TRAINING |
Aizah Valenciano | Toshiba Information Equipment (Philippines) | R&D/ROADMAP |
Gerson Bantag | Texas Instruments | R&D/ROADMAP |
Leilani Cabudoy | onsemi | ADVOCACY |
Rachel Encarnacion | Analog Devices | ADVOCACY |
Rhea Labro | Western Digital | INFORMATION |
Lani Valle | Ionics EMS | INFORMATION |
Mary Joy Garcia | Amkor Technology | NETWORKING |
Cyras Palmos | SunPower Philippines Manufacturing | NETWORKING |
Airene Reyes | Microchip Technology Operations Corporation | SERVICES |
Chie Dizon | Gruppo EMS | SERVICES |
Training
R&D
Advocacy
Information
Networking
Service
For more information, please contact mary.tayag@seipi.org.ph
Quarterly Meetings
Q1 RMM
Q2 RMM
Q3 RMM
Q4 RMM
ASPM is the venue for sharing information among SEIPI member-companies on best procurement practices, localization of raw materials, supplier co-development and other related matters. Its objectives are: To increase purchasing effectiveness and productivity to develop the industry’s supply base and purchasing environment to increase the purchasing contribution to the employer organizations’ survival and growth; To continually develop purchasing competencies and perform above the standards of the purchasing profession.
NAME | COMPANY | NWC POSITION | |
|---|---|---|---|
Mary Anne Garcia | Aumovio | CHAIRPERSON | |
Jenetty Lirasan | Philippine Manufacturing Co. of Murata | DEPUTY CHAIRPERSON | |
John Nomer Gabutero | Toshiba | TRAINING | |
Elizabeth Dela Rosa | Western Digital | TRAINING | |
Ria Ayson | Analog Devices | R&D/ROADMAP | |
Madel Valdez | SunPower Philippines Manufacturing | R&D/ROADMAP | |
Melanie Urbano | Microchip Technology | ADVOCACY | |
Raymond Chua | MEPZ Mixed Gases Corp. | ADVOCACY | |
Danny Javid | Gruppo EMS | INFORMATION | |
Jenetty Lirasan | Philippine Manufacturing Co. of Murata | INFORMATION | |
Angelita Sta. Maria | Amkor Technology | NETWORKING | |
Perly Lazo | Ionics EMS | NETWORKING | |
Mary Anne Garcia | Aumovio | NETWORKING | |
Ingrid Aloba | Teradyne | SERVICES | |
Daisy Umayam | onsemi Carmona | SERVICES |