Networking Committee Meetings
The Networking Committees (NWCs) are attended by Directors/Senior Managers, Managers and supervisors, to act as the platform for benchmarking and exchange of ideas. Through the NWCs, SEIPI organizes a wide variety of training programs to strengthen the global competitiveness of the industry.
AESSEP is the venue for sharing of best known practices on environmental health and safety, plant engineering and facilities maintenance, space utilization and operation reliability. Its vision is to be the role model among various industries in ensuring safety in the workplace, preserving the environment and keeping abreast mission is to encourage members to achieve and maintain a safe and environment friendly industry through: continuous education and training, compliance to regulations and standars, clean technology, energy management, equipment reliability and facilities management.
NAME | COMPANY | NWC POSITION | |
|---|---|---|---|
Mylene Armamento | Amkor Technology Philippines, Inc. | Training | |
Jocelyn Daluraya | Analog Devices Gen. Trias Inc. | Training | |
Nelson Ibis | Continental Temic Electronics (Phils.). Inc. | Chairperson | |
Marck Magapi | Gruppo EMS, Inc. | R&D | |
Ronald Domingo | Ibiden Philippines, Inc. | Advocacy | |
Felize Pelaez | Integrated Micro-Electronics, Inc. | Advocacy | |
Mark Deodoro | Ionics EMS, Inc. | Information | |
Jess Peralta | Maxeon Solar Technologies | Information | |
Gemma Domingo | Microchip Technology Operations Corporation | Information | |
Ma. Gina Picardal | onsemi | Networking | |
Rodelio Carino | Texas Instruments (Philippines), Inc. | Deputy Chairperson | |
Sandra Chu | Toshiba | Services | |
Edgard Reyes | Western Digital Philippines | Networking |
2024 Priorities
2024 Projects
Training
R&D/Research
Advocacy
Information
Networking
Service
Q1
Q2
Q3
Q4
For more information, please contact marizol.calinagan@seipi.org.ph
SEIPI’s networking committee that continuously works on the best security professional practices, which shares a common goal amongst SEIPI members. Its vision is to provide leadership role in the design and propagation of effective security business practices and application for semiconductor and electronics industries in the Philippines.
NAME | COMPANY | NWC POSITION | |
|---|---|---|---|
Rommel Ligayo | Amkor Technology Philippines, Inc. | Chairperson/R&D | |
Edwin Perez | Analog Devices Gen. Trias Inc. | Information | |
Norman Alpuerto | Continental Temic Electronics (Phils.). Inc | Deputy Chairperson/Training | |
Eduardo Guese | Gruppo EMS, Inc. | Services | |
Celeste Franche | Ibiden Philippines Inc. | Networking | |
Jess Aleluya | Integrated Micro-Electronics, Inc. | Training | |
Nestor Pepito | Ionics EMS, Inc. | Advocacy | |
Jess Peralta | Maxeon Solar Technologies | Advocacy | |
Robinie Batacandolo | Microchip Technology Operations Corporation | R & D | |
Leandre Llanera | Microchip Technology Operations Corporation | R & D | |
Lawrence Abello | onsemi | R & D | |
Pete Sherwin Villanueva | Erwin Abao | Teradyne | Networking | |
Patrick Chagsan | Randy Acorda | Texas Instruments (Philippines), Inc. | Services | |
Emyr Ramos | Edgar Santos | Toshiba Info. | Training | |
Dustin Dreyfus | Western Digital Philippines | Information | |
Pol Camacho | Nilo Pomaloy | Shieldcoach Security Company | Adviser |
Top three (3) priorities for 2024
Training
R&D
Advocacy
Information
Networking
Service
ASEFEX is the gathering of finance executives practicing in the semiconductor and electronics industry, bonded by the spirit of volunteerism for the benefit of the industry as a whole and members’ respective companies in particular. ASEFEX envisions to be the strategic partner of SEIPI in driving the Philippine semiconductor and electronics industry towards global competitiveness through excellence and leadership in the field of finance. Its mission is to advocate the development, implementation and advancement of the industry by promoting information sharing, benchmarking, training and development, values formation and networking on relevant financial issues for the benefit of SEIPI member companies and the industry as a whole.
NAME | COMPANY | NWC POSITION | |
|---|---|---|---|
William Garcia | Amkor Technology Philippines, Inc. | ADVISER | |
Aimee Banzuela | Analog Devices Gen. Trias Inc. | CHAIRPERSON | |
Marvi Mangona | Continental Temic Electronics (Phils.). Inc | INFORMATION | |
Atty. Emy Rose Garin | Gruppo EMS, Inc. | ADVOCACY | |
Felix Halili | Ibiden Philippines Inc. | NETWORKING | |
Neilson Esguerra | Integrated Micro-Electronics, Inc. | SERVICES | |
Ron Andade | Ionics EMS, Inc. | ADVOCACY | |
Minerva Jose | Microchip Technology Operations Corporation | DEPUTY CHAIRPERSON | |
Geraldine Decena | onsemi | INFORMATION | |
Mary Jane Abangan | Teradyne | TRAINING | |
Nicholas Murphy | Texas Instruments Philippines | R&D/ROADMAP | |
Noralyn Florencio | Toshiba | NETWORKING | |
Marivic Perlada | Western Digital Philippines | SERVICES | |
Dexter Medilla | Asurion TCP | ADVISER |
Quarterly Meetings
March
June
September
December
For more information, please contact analin.lozano@seipi.org.ph
ASEMEP provides support to member-companies in benchmarking manufacturing activities, technical trainings and strategic planning. It hosts the annual National Technical Symposium aimed at showcasing technical expertise of SEIPI semiconductors and electronics engineers. The group is likewise pursuing a strong and active
Academe-Government-Industry Forum to help shape a more relevant technical and engineering education curriculum
Under ASEMEP are four (4) Community of Practices (COPs) whose objective is to foster intellectual exchange between different engineering practices in the semiconductor and electronics industry.
These are:
- Semiconductor and Electronics Training Council (SETC)
- ASEMEP ESD Council (AEC)
- ASEMEP Quality and Productivity Council (AQ&PC)
- Council of Failure Analysis and Reliability (CFAR)
Vision
Create ENABLED manufacturing engineers in the semiconductor and electronics industry. Engineers Networked to achieve Advanced technology Breakthroughs that would Lead to Economic and social Development.
Mission
To keep our fellow engineers abreast with the technological development both in local and foreign endeavors. To promote and participate in programs supportive of both industry and national interest, particularly in technical skills development, industry-academe linkage and corporate social responsibility. To be the preferred venue and forum where engineers can share their technical competence. To enable community of practices that will foster intellectual exchange.
ASEMEP COMMUNITY OF PRACTICE (COPs)
NAME | COMPANY | NWC POSITION |
|---|---|---|
Ruth Jacob | Amkor Technology Philippines, Inc | Training |
Rey Luares | Analog Devices Gen. Trias Inc. | Chairperson |
Rey Lanto | Continental Temic Electronics (Phils.), Inc. | Services |
Chito Del Mundo/Guillermo Mendoza | Gruppo EMS, Inc. | Advocacy |
Ronald Hilaria | Integrated Micro-Electronics, Inc. | Training |
Emma Gerodias | Ionics EMS, Inc. | Advocacy |
Donald Cruz | Microchip Technology Operations Corporation | Information |
Peter Awayan | onsemi Carmona | Information |
Dennis Aguilar | Philippine Manufacturing Co. of Murata, Inc. | R&D/Roadmap |
Joevimen Gaudite | Minebea Mitsumi Inc. | R&D/Roadmap |
David Martinez | Teradyne Philippines Limited | Training |
Laura May Antoinette Clemente | Texas Instruments (Philippines), Inc. | Deputy Chairperson |
Rholet Ursais | Toshiba Information Equipment (Philippines), Inc. | Services |
Aileen Jara | Western Digital Philippines | Networking |
Ian Harvey Arellano | ST Microelectronics | R&D/Roadmap |
1.1 ASEMEP ESD COUNCIL (AEC)
NAME | COMPANY | NWC POSITION |
|---|---|---|
Ferdinand Macalintal | Amkor Technology Philippines, Inc. | R&D/Roadmap |
Raymond Sietereales | Analog Devices Gen. Trias Inc. | Networking |
Ara Malabanan | Automated Technology Phils., Inc. | Services |
Jose Pulgado Jr. | Continental Temic Electronics (Phils.). Inc | Information |
Eduard Joseph Amutan | Gruppo EMS, Inc. | Training |
Laurelyn Silva | Ibiden Philippines Inc. | Advocacy |
Fermin Traquina | Integrated Micro-Electronics, Inc. | Networking |
Ely Torrecampo | Ionics EMS, Inc. | Deputy Chairperson |
Bobby Tovera | Glenn Dimaculangan | Microchip Technology Operations Corporation | Advocacy |
Celon Cada | onsemi | Networking |
Genes Encontro | Teradyne | Training |
Ian Kenneth Santiago | Texas Instruments (Philippines), Inc. | Advocacy |
Estrellita Nave | Toshiba | Chairperson |
Fronie Aligway | Minebea Mitsumi Inc. | Networking |
Roger Dumpit | ST Microelectronics, Inc. | R&D/Roadmap |
Vincent Confesor | ST Microelectronics, Inc. | Training |
Julio Contreras Jr. | Philippine Manufacturing Co. of Murata | Information |
1.2 ASEMEP QUALITY & PRODUCTIVITY COUNCIL (AQ&PC)
NAME | COMPANY | NWC POSITION |
|---|---|---|
Jun Capacete | Amkor Technology Philippines, Inc. | ‘Training |
Eric Cadena | Analog Devices Gen. Trias Inc. | R&D/Roadmap |
Marie Antazo | Automated Technology (Phils.), Inc. | Advocacy |
Kathleen Alvarez | Continental Temic Electronics (Phils.). Inc | Information |
Sheila Dela Pena/Agnes Zamora | Gruppo EMS, Inc. | Networking |
Christopher Domingo | Ionics EMS, Inc. | Services |
Marites Gonzales/Emerito Paredes | Integrated Micro-Electronics, Inc. | Networking |
Valerie Joyce Fernandez | Maxeon Solar Technologies | Deputy Chairperson |
Michelle Lumawag, Ma AngelicaCapistrano | Microchip Technology Operations (Philippines) Corporation | Information |
Fronie Aligway | Minebea Mitsumi Inc. | Services |
Crescencio Penton | Philippine Manufacturing Co. of Murata, Inc. | Training |
Jocelyn Siapco | onsemi (Carmona) | Chairperson |
Marlyn V. Sebastian | onsemi (Tarlac) | Advocacy |
Gerefil Sayson | Teradyne Philippines Limited | Networking |
Cyrus Nazareno (Baguio), Howell Corpuz (Clark) | Texas Instruments Philippines | ‘Networking |
Emilan Sordan | Toshiba Information Equipment (Philippines), Inc. | Training |
Glenn Ponce | Western Digital Philippines | R&D/Roadmap |
1.3 COUNCIL FOR FAILURE ANALYSIS & RELIABILITY (CFAR)
NAME | COMPANY | NWC POSITION |
|---|---|---|
Celia Corpuz | Amkor Technology Philippines, Inc. | Information |
Jason Lagar | Analog Devices, Inc | Training |
Ailyn Tan | Automated Technology Philippines, Inc. | Information |
Jayvee Cometa | Gruppo EMS, Inc. | Services |
Gilbert Diwa | Integrated Micro-Electronics, Inc | R&D/Roadmap |
Leo Mirabuna | Ionics EMS, Inc. | Services |
Gareth Glenn Angsanto | Microchip Technology, Inc | Advocacy |
Nerwin Beronio | Microchip Technology, Inc | Advocacy |
Lilia Unite | Microchip Technology, Inc | Advocacy |
Charlie Estela | Microchip Technology, Inc | Advocacy |
Patrick Recella | Onsemi – Carmona | Networking |
David Martinez | Teradyne Philippines, Ltd. | Advocacy |
Jesse Jagape | STMicroelectronics, Inc. | Training |
Ferdinand Abitan | Texas Instruments Philippines, Inc. | Networking |
Jennifer Ballesteros | Toshiba | Deputy Chairperson |
Flordeliza Licot-Llaneta | Western Digital Philippines | Chairperson |
Fronie Aligway | Minebea Mitsumi, Inc. | R&D/Roadmap |
Kristian Dan Mista | Philippine Manufacturing Co. of Murata, Inc. | R&D/Roadmap |
Marie Lianne Alido | Continental | Networking |
Jesse Jagape | STMicroelectronics, Inc. | Training |
1.4 SEIPI TRAINING COUNCIL (SETC)
NAME | COMPANY | NWC POSITION |
|---|---|---|
Patricia Paula Perez | Amkor Technology Philippines, Inc. | Information |
Rumela Fei Gloriani | Analog Devices, Inc | Advocacy |
Erwin M. Aguilar | Continental Temic Electronics (Phils.). Inc. | Deputy Chairman |
Jerry Salangsang | Gruppo EMS, Inc. | Information |
April Leen Lopena | Ibiden Philippines Inc | Training |
Sofia De Castro | Ibiden Philippines Inc | Networking |
Ronald A. Gabasan | Integrated Micro-Electronics, Inc. | Chairperson |
Rechelle Manguiat | Integrated Micro-Electronics, Inc. | Services |
Nicholas Agor III | Ionics EMS, Inc. | Information |
Snooky Jarina | Maxeon Solar Technologies | Services |
Lester Uy | Microchip Technology Operations Corporation | Advocacy |
Albert Garcia | onsemi – Carmona | Advocacy |
Louie Dizon | onsemi – Tarlac | Advocacy |
Genes Encontro | Teradyne Philippines, Ltd. | R&D/Roadmap |
Ellaine Mendoza | Texas Instruments Phils., Inc. | Training |
Nordeliza Tinacba | Toshiba | R & D/Roadmap |
Adrian Dorin | Toshiba | Networking |
Joycel Ipil | Western Digital Philippines | Services |
Michelle Dela Cruz | Western Digital Philippines | Services |
Francisco Baldemor | STMicroelectronics, Inc. | R&D/Roadmap |
Manuel Balasa | Minebea Mitsumi, Inc. | Networking |
Mary Rose Garcia | Philippine Manufacturing Co. of Murata, Inc. | Training |
Marlyn Losabio | Philippine Manufacturing Co. of Murata, Inc. | Training |
Top 3 Priorities for 2024 (ASEMEP)
Top 3 Priorities for 2024 (AEC)
Top 3 Priorities for 2024 (AQ&PC)
Top 3 Priorities for 2024 (SETC)
Top 3 Priorities for 2024 (CFAR)
(ASEMEP)
Training
R&D
Advocacy
Information
Networking
Service
(SETC)
Training
R&D
Advocacy
Information
Networking
Service
(CFAR)
Training
R&D
Advocacy
Information
Networking
Service
(AEC)
Training
R&D
Advocacy
Information
Networking
Service
(AQ&PC)
Training
R&D
Advocacy
Information
Networking
Service
2025 NWC WEBINAR SCHEDULES
ASSOCIATION OF SEMICONDUCTOR AND ELECTRONICS MANUFACTURING ENGINEERS OF THE PHILIPPINES
(ASEMEP
Online team building (ASEMEP and
COPs)
Q2 GMM
Q3 GMM
Joint webinar with ASITEP and
AESSEP on Q3 (IR 4.0)
ANTS 2025
CSR Activity for all COPs
For more information, please contact us at rose.duazo@seipi.org.ph
ASEMEP ESD COUNCIL (AEC)
Q2 GMM
Q2 GMM
Virtual ASEMEP National Technical
SymposiuM
For more information, please contact us at rose.duazo@seipi.org.ph
ASEMEP QUALITY & PRODUCTIVITY COUNCIL (AQ&PC)
Q1 RMM
Q2 RMM
AQ&PC BENCHMARKING CONVENTION
Q4 RMM
For more information, please contact us at rose.duazo@seipi.org.ph
COUNCIL FOR FAILURE ANALYSIS & RELIABILITY (CFAR)
Q1 RMM
Q2 RMM
Q3 RMM
CFAR Virtual Annual Forum
For more information, please contact us at oscar.pardenas@seipi.org.ph
SEIPI TRAINING COUNCIL (SETC)
Q1 RMM
Q2 RMM
SETC Training Summit
Q4 RMM
For more information, please contact us at oscar.pardenas@seipi.org.ph
2022
Academe
- AQMoD An IoT Implementation of Air Monitoring, Mapping , and Warning System Using Drone Technology.pdf
- BIKESECURE – An IoT – Based Bicycle Security System With Image Capturing and Location Tracking.pdf
- Cashless and Contactless Fare Payment System for Public Utility Vehicle.pdf
- Ground Fissue Detection System Using Raspberry PI and Drone Technology.pdf
- Low-Cost Solar-Powered Hydroponics Water Quality Automation System.pdf
- Microcontroller-Based Automated Disinfection Machine With Attendance and Temperature Monitoring System.pdf
- Real-Time Facemasks Detection With Temperature Checking System.pdf
- Smart Hard Hat With Emergency Alert and Tracking System Using Arduino.pdf
- Solar-Powered Greenhouse System for Lettuce Using Arduino.pdf
Assembly Manufacturing
- A Capacity Up Improvement in Printed Circuit Board Assembly (PCBA) Removal Thru Total Productive Industrial Engineering (TPIE) Approach.pdf
- Automated Dispense Nozzle Cleaning Machine – TI Inside.pdf
- Bond Pad Crack Elimination on Power Semiconductor Devices With Sensitive Bond Pad Structure.pdf
- Design and Application of a CMOS Imager Based Barcode Recognition System in Enterprise SSD Traceability System.pdf
- Efficient and Low-Cost High Speed Electrolytic Belt Stripping Chemical Solution.pdf
- Error Proofing Detection of Wire Entanglement During Wirebonding – Stop the Risk on WRWR Resolution.pdf
- Increasing Overall Tool Availability – Costless Investment Through Wafer Sourcing and Recycling.pdf
- Influence of Blade Usage in the Occurrence of SN Metal Burrsduring Full Cut Singulation of Wettable Flank QFN Package.pdf
- Optimization of Laser Marking Parameters for Wettable Flank QFN Package Through Response Surface Methodology.pdf
- Package Integrity Improvement for Dual Pad Clip Bond Packages.pdf
- Plating Thickness SPC CPK Improvement – A New Way to Strategize SPC.pdf
- Reduction in Wafer Residual Resist Thru Effective Wafer Spin Speed Augmentation.pdf
Failure Analysis and Reliability
- ADVANCING FAILURE ANALYSIS THROUGH AUTO-DEFECT IMAGING FOR BIG DATA ANALYTICS.pdf
- Die Crack Resolution Using Fractography and Mechanical Stress Simulation.pdf
- DIE CRACK SIMULATION – UNDERSTANDING DIE WEAKNESS IN THE PRESENCE OF DIE ATTACH SOLDER VOIDIN CLIP BOND DEVICES.pdf
- FASTER SETUP TIME USING THE CONVERTER BENCH SYSTEM USING LABVIEW AND NI-6363.pdf
- Fault Localization of Temperature-Dependent Digital Circuit Functional Failures Utilizing the Scan-based Bench Testing and the DALS .pdf
- NON-DESTRUCTIVE PACKAGE-LEVEL FAULT LOCALIZATION IN CHIP SCALE PACKAGE BALL GRID ARRAY (CSP-BGA) DEVICES.pdf
- PHYSICAL FAILURE ANALYSIS OF HDCP-RELATED FAILURE INAHIGH SPEED SERDES.pdf
- REDEFINED IMC COVERAGE METHODOLOGY FOR PCC-CU WIRES BONDED TO ALUMINUM PAD.pdf
- SELECTIVE BACKSIDE DECAPSULATION ON MULTIPLE PADDLED DEVICES WITH DOWNBONDS1.pdf
- UTILIZATION OF ELITE SYSTEM FOR PRECISE FAULT LOCALIZATION OF FUNCTIONAL FAILING INTEGRATED CIRCUIT (IC).pdf
Product
- HALF-BRIDGE SILICON CARBIDE POWER MODULE STRAY INDUCTANCE EXTRACTION USING LOW VOLTAGE –LOW CURRENT TEST METHOD.pdf
- HOW TO ACHIEVE A QUALITY LEVEL 3 IBIS MODEL THROUGH BENCH MEASUREMENT.pdf
- PLASMA OPTIMIZATION FOR SILVER-PLATED COPPER LEADFRAMES.pdf
- THERMAL EXPANSION SIMULATION OF SINGULATED MOLDED SUBSTRATE THROUGH FINITE ELEMENT ANALYSIS.pdf
Quality System
- ELIMINATION OF DISTURBED WIREIN SOIC8 & SOIC16 PACKAGES.pdf
- EMPOWERING LEAN PRINCIPLES IN AUTOMOTIVE MANUFACTURING INDUSTRY – ADDRESSING THE CHALLENGES AND CAPTURING BEST PRACTICES.pdf
- HANDS-FREE TURNSTILE
- IMPROVEMENT OF LOW LEVEL EPOXY SENSING AND ELIMINATION OF HUMAN INTRUSION.pdf
- LASER CUTTING MACHINE IMPROVEMENT AND DEFECT REDUCTION THROUGH VACUUM OPTIMIZATION.pdf
- MACHINE QUALIFICATION – SETTING A NEW STANDARD.pdf
- MANAGING SCRAP – A BENCHMARK APPROACH.pdf
- REDUCTION OF QC FAILURES RELATED TOELECTRICALLY-INDUCED PHYSICAL DAMAGE.pdf
- SURFACE CONTAMINATION REDUCTION ON CLEAN BOOTH AREA.pdf
- The Flash Back – Resolving Customer Power Pad Mounting Issues through Flash Prevention and Enabling Auto Back Side Inspection.pdf
Support System
- 31st ANTS_PROCESS CONTROL AND CERTIFICATION_REDEFINING ORDINARY TO EXTRAORDINARY SOLUTIONS.pdf
- 31st ANTS_TOWARDS THE FUTURE OF DATA SCIENCE RESTRUCTURING THE UNSTRUCTURED LEGACY SOLUTIONS.pdf
- DIGITAL PRESSURE GAUGE READING USING TRANSFER LEARNING.pdf
- INNOVATIONOF ENERGY METERS THROUGHACCURATE MONITORINGON ENERGY CONSUMPTIONOF END-USER TO CREATE ENERGY EFFICIENCY AND CONSERVATION PROGRAMS.pdf
- Uninterruptible Supply of Compressed Dry Air using Liquid Nitrogen.pdf
Test Manufacturing
- A SIMPLE METHOD FOF CATCHING INTERMITTENT FAILURES.pdf
- AUTOMATED WAFER MAP CREATION FROM FINAL TEST DATA AND PATTERN CLASSIFICATION USING MACHINE LEARNING.pdf
- DEMYSTIFIED THROUGH PATTERNS – PROBLEM-SOLVING USING DATA ANALYSIS, DETECTION, PREDICTION, & PREVENTION.pdf
- ELIMINATION OF TEST ESCAPE ISSUES ON TEST HANDLER.pdf
- ENTANGLED UNITS’ PREVENTION – RASCO SIP TEST HANDLER HOPPER DESIGN .pdf
- EOS PREVENTION ADVOCACY – IN LINE TEST METHOD FOR CAPTURING DEFECTIVE BYPASS CAPACITORS IN TEST PERFORMANCE BOARDS THROUGH AN AUTOMATED TEST EQUIPMENT.pdf
- FINDING THESWEET SPOT – A DEEP-DIVE ANALYSIS ON NON-GENUINELOAD BOARD CHECK FAILS.pdf
- GREEN LASER – THE BREAKTHROUGH BRANDING TECHNOLOGY FOR 5G PRODUCTS.pdf
- INTELLIGENT THERMAL CONTROL & SOAK TIME REDUCTION, A SOLUTION TO IMPROVE CAPACITY AND UTILIZATION.pdf
- LIFTED LEADS ELIMINATION AT FINAL TEST USING RELIABILITYCENTEREDMAINTENANCE METHODOLOGY.pdf
- MACHINE LEARNING – FEATURE SELECTION FROM HIGH DIMENSIONAL DATA FOR EARLY DETECTION OF FAILURES ON SEMICONDUCTOR DEVICES.pdf
- MYSTERY UNLOCKED, DIAPHRAGM PRESSURE – THE KEY TO RESOLVE CONTACT SENSITIVITY.pdf
- PCB design board simulation Discovery – Eradicating Unwanted Voltage through Efficient Filter Lay-out.pdf
- RF Noise Reduction thru Test Signal Averaging.pdf
- Validation of Pressure Sensitive Adhesive asAlternative Accelerometer Attachment on Aluminum Alloy Jig under Vibration Test.pdf
- VALIDATION TO VERIFICATION(V2V) – AN ULTRAFLEX TOTEST VECTOR TRANSLATOR
2023
Assembly Manufacturing
- Adapting Lean & Advance Manufacturing Technology at OSS INS Assembly Line_FINAL.pdf
- ADAS_MULTI-FUNCTION_LIDAR_SCRAP_ELIMINATION.pdf
- AUGMENTING CAPABILITY OF BOTTLENECK PROCESS AT CCU BACK-END ASSEMBLY.pdf
- BRIDGE PICK TOOL MODIFICATION ON DACA MACHINES FOR TILTED CLIP AND CRACK DIE REJECT REDUCTION.pdf
- DEVELOPMENT AND CHALLENGES OF HIGH FEED SPEED.pdf
- ELEVATING PROCESS CONTROL AND CERTIFICATION UTILIZING ALID.pdf
- Eliminating Inductive Kickback by Using Diode as Surge Suppressor for BSAVI Machines.pdf
- Eliminating Short Circuit on Plc Signals Through the Use of Wire Jumper for FAVI Machines.pdf
- Embracing Evolution Photoresist Stripping 2.0.pdf
- Excessive Flashing Reduction on Plad Single-Die Bi-rectional Devices Thru Stack Height Analysis.pdf
- FORGING THE FOUNDATION OF LIGHTS OUT STRATEGY FOR INSPECTION BY SUSTAINING PACKAGE EXCELLENCE THROUGH SMARTT SAMPLING.pdf
- IMPACT OF LOW TEMPERATURE MOLD CLEANER CONDITIONER ON MOLD PROCESS.pdf
- JLP CABLE ASSEMBLY AND HARNESS CYCLE TIME REDUCTION THROUGH AUTOMATIC CONTINUITY TESTING.pdf
- LINE BALANCING IN SAS LINE 6 THROUGH CYCLE TIME OPTIMIZATION.pdf
- PD• 6NH3• 2RX NEW PALLADIUM ELECTROLYTE FORMULATION ENABLING THINNER METAL OPTIMUM DEPOSITION.pdf
- PNP Head Matrix II Asynchronous Pick Body Stroke; Causes, Effects, and Solutions.pdf
- Prevention of Servomotor Burn By Replacing Motor With Higher Torque.pdf
- REDUCING ELECTRICAL TEST OUTLIERS THROUGH SILVER SINTERING DIE ATTACH METHOD OPTIMIZATION.pdf
- REDUCTION OF CRUMPLED STRIPS OCCURRENCE FOR SOHED AT MECO-01.pdf
- REDUCTION OF LOW VACUUM PRESSURE READING ON VACUUM PROCESSOR.pdf
- REDUCTION OF PROCESS CYCLE TIME THROUGH THE INNOVATION OF MANUAL OR SEMI-AUTO JIGS & FIXTURES D.I.A.D.O.I. BASED APPROACH.pdf
- SAWING PROCESS STREAMLINING BY FULL CUT INTRODUCTION ON ULTRA THIN WAFERS.pdf
- SEMI-AUTOMATIC CRIMPING MACHINE SET-UP CYCLE TIME IMPROVEMENT THROUGH STANDARDIZATION OF PARAMETER SELECTION AND KITTING PROCESS.pdf
- SOT227 PRE-FORM FINAL FORM POKA-YOKE FOR TOOL PARTS BREAKAGE.pdf
- SURFACE IONIZATION EFFECT OF MIXED GAS Ar+H2 PLASMA.pdf
- SUSTAINABLE DEVELOPMENT A GUIDE TO PLATING COST EFFICIENCY.pdf
- ULTRA SHORT PULSE (USP) LASER GROOVING A NEW SAWING TECHNIQUE TO ADDRESS DIE STRENGTH ISSUES IN THINNER PACKAGES.pdf
- WAFER SAW PROCESS IMPROVEMENT THROUGH LASER GROOVE KERF CHECK OPTIMIZATION.pdf
- WIRELESS DETECTION OF ELECTROSTATIC DISCHARGE (ESD) EVENT THROUGH.pdf
Failure Analysis and Reliability
- Conductive Die Attach Delamnination on C19210.pdf
- DELAMINATION ANALYSIS OF AN ALN (DIRECT BOND COPPER SUBSTRATE) USING FINITE ELEMENT ANALYSIS (FEA) – BA, BM, CVC.pdf
- Elimination of Peel Off UV Adhesive on UV Shoulder.pdf
- Fractographic Analysis of Die Crack Simulated Under Different Fracturing Conditions.pdf
- HIGHLY ACCELERATED LIFE TEST AND ENVIRONMENTAL-3 ORT OPTIMIZATION_GSumalinog.pdf
- Impact of Die Attach Film Elastic Modulus on Adhesion and Package Reliability.pdf
- OUTRIGHT DETECTION OF DR TO DIA ASSY LEVEL RELIABILITY FAILURES_DPatarata.pdf
- Risk of Bulk Containers for ESD Sensitive Devices.pdf
- Validation of Pressure Sensitive Adhesive Naredo-Ebero-Diwa.pdf
Product
- ADDRESSING CRITICAL WIREBOND LOOP CHALLENGES ON AUTOMOTIVE MEMS DEVICE WITH STACKED-DICE CONFIGURATION.pdf
- Adhesion Enhancement via Surface Mechanical Treatment On ACP.pdf
- Control and Simulation of electrolytic migration_fullpaper.pdf
- Deep-Dive Investigation on Pad Discoloration Issue in Optical Sensing Device.pdf
- Introduction of Descaling for the Improvement of Half Cut Singulation Process of Wettable Flank QFN Packages.pdf
- Optimal Design of SiC MOSFET Half Bridge Power Module for 200A Current Rating based on Electrothermal Simulation.pdf
- Solder-induced HAST Failures.pdf
Quality System
- CACB RASCO JUPITER 2 COMMITTED MANUFACTURING CAPACITY (CMC) INSERTION IMPROVEMENT.pdf
- CHALLENGING THE PROCESS AND MATERIAL CHARACTERISTIC TO ADDRESS THE HIGH EPOXY USAGE CONSUMPTION OF VI POWER PACKAGES.pdf
- COMPARATIVE STUDY OF TWO SCANNING TECHNIQUES IN AUTOMATIC SIDE VISUAL INSPECTION OF WETTABLE FLANK QFN PACKAGES.pdf
- Device “T” Electrical Yield Improvement.pdf
- DEVISING VARIATION REDUCTION TECHNIQUES FROM STATISTICAL PROCESS CONTROL (SPC) SIGNALS TO ACHIEVE WIREBOND PROCESS STABILITY.pdf
- ELIMINATION OF BROKEN WIRE AT HEEL FOR SSOP PACKAGE.pdf
- ELIMINATION OF CONDUCTIVE DIE ATTACH FILM INTERFACIAL DELAMINATION DUE TO INTRINSIC HIGH ASPECT RATIO ULTRATHIN HIGH DIE BOW LEVEL.pdf
- Elimination of Mixed Device_onsemi Car_Eugenio.pdf
- Elimination of PCBA Related Functional Defects on Amber or Opal Machine by Improving M03-A13-00 Jadeback Connector Assembly using Sold.pdf
- ELIMINATION OF RBFA DISTURBED WIRE OCCURRENCE.pdf
- FT Guardband A Structural Solution Control in Screening Lots for Test.pdf
- IMPROVED MOLD TOOL DESIGN ROBUSTNESS THROUGH THE DMAIC PROCESS (Nexperia_WPena)
- LEADTIME IMPROVEMENT – BALANCED ARMATURE AGING REDUCTION_MPTorralba.pdf
- NETWORK SYSTEMS SOLUTIONS INTEGRATION TO ELIMINATE MISSING OR INCOMPLETE SUPPLIER KEY DATA USED FOR COMPONENT TRACEABILITY.pdf
- OVER REJECTION DOWNTIME REDUCTION THROUGH MAGNETIZED CLEANING BRUSH.pdf
- Reduction of 3rd Opt Yield Off and Fallen Units_Technical Paper Template.pdf
- REDUCTION OF DENTS THROUGH INSTALLATION OF EJECTOR PINS ON COMPOUND DIE.pdf
- Reduction of DIGHSB Board Failure on Device “S”.pdf
- Reduction of Module 2 Detape Rate.pdf
- REDUCTION OF OVER REJECTION AT 5 SIDES VISION OF TEST & TAPE MACHINES.pdf
- REDUCTION OF STRAY WIRE RBFA INCIDENT AT WIRE BOND.pdf
- TESTING PROCESS ROBUSTNESS ELIMINATION OF POTENTIAL MIXING CUSTOMER COMPLAIN THROUGH ERROR PROOFING METHODOLOGY.pdf
- Three_Way_Test_Detection_Enhancement_Paper.pdf
- VALUE STREAM MAPPING (VSM) ON MAP AVAILABILITY AT INCOMING QUALITY CONTROL (IQC) PHASE A LEAN APPROACH TO LEAD TIME REDUCTION AND MANUFACTURING EFFICIENCY IMPROVEMENT.pdf
Support System
- AUTOMOLD CELL CONTROLLER AUTOMATION OF MOLD MACHINES TO REDUCE QUALITY ISSUES.pdf
- DATA ANALYTICS THROUGH FAILURE CODE TRIGGER AND MULTI-LEVEL SCORECARD.pdf
- Elimination of External and Internal Findings_onsemi Car_Gabriel.pdf
- IMPROVEMENT OF PRODUCT RELEASE CHANGE ORDER (PRCO) PROCESS THROUGH PIMES SYSTEM INTEGRATION AND DIGITIZATION.pdf
- REUSING OF REVERSE OSMOSIS (RO) REJECT WATER THROUGH CREATION OF WATER HARVESTING SYSTEM TO CONSERVE WATER
Test Manufacturing
- 3D SIMULATION SOFTWARE EFFECTIVE TOOL ON REDESIGNING CLAMPING MECHANISM FOR DAMAGED STRIP ELIMINATION.pdf
- AN INNOVATIVE SOLUTION TO ELIMINATE MANUAL HANDLING WITH THE INTRODUCTION OF AUTO FLIPPER TECHNOLOGY FOR DEAD BUG MODULE.pdf
- ELIMINATION OF MIXING OF TESTED AND UNTESTED UNITS AT SENSOR FINAL TEST USING MECHANICAL ERROR-PROOFING_32nd ANTS_Technical Paper Template_V00_20230623.pdf
- IMPROVING CONTACT RELIABILITY THRU RCM APPROACH.pdf
- Issue Resolution Cycle Time Reduction in Test Escape and Mixing Events using Jira.pdf
- Latch-up Tester Hidden Threats Beneath 100V 1A_final.pdf
- ONE-SHOT PPE DETECTION FOR BAKE OVENS USING RESNET50 CONVOLUTIONAL NEURAL NETWORK.pdf
- QC FAILURE ELIMINATION PREDICTING CURRENT SENSE TEST FAILURES THROUGH LINEAR REGRESSION.pdf
- TEST HANDLER JAM REDUCTION AN IN-DEPTH ROOT-CAUSE ANALYSIS APPROACH ON UP DOWN MOTOR ASSEMBLY FAILURE USING RELIABILITY CENTERED MAINTENANCE (RCM) METHODOLOGY.pdf
- TEST_EQUIPMENT_INTELLIGENT_EDGE_SOLUTION_FOR_PACKAGE_CRACK_PREVENTION.pdf
- Tester Efficiency Improvement
2024
Academe
- Detection of Violators of Garbage Disposal.pdf
- ECOSENSE IOT-DRIVEN POWER MONITORING AND CENTRALIZED CONTROL SYSTEM FOR ENERGY CONSERVATION.pdf
- GESTULEARN HAND TRACKING AND GESTURE RECOGNITION TECHNOLOGY FOR ASSISTIVE TEACHING IN SPECIAL EDUCATION.pdf
- Real-Time-Airconditioning-Unit-Monitoring-System-with-Analytics-for-Predictive-Maintenance.pdf
- SMART WASTE MANAGEMENT IN POULTRY FARMS MONITORING AND CONTROLLING AMMONIA AND FLY INFESTATIONS.pdf
Assembly Manufacturing
- A Comparative Study of Rule-Based Image Processing_onsemi Carmona.pdf
- ACHIEVING OPTIMAL PROCESS EFFICIENCY-AUTOMATED SOLUTIONS FOR PRODUCT SAMPLING AND TOOL STATE CHANGE.pdf
- APPLICATION OF PACKAGE STRESS REDUCTION STUDY REENGINEERING OF CHUTE PUSHER SPRING HOLDER ASSEMBLY FOR CLIPBONDED HANMI TRIM AND FORM MACHINES.pdf
- Arduino UNO and Design Thinking Empowers Tape Curing Process Control Advancements.pdf
- AUTOMATED CYCLE TIME AND PROCESS BOTTLENECK ANALYSIS THROUGH INTEGRATION OF AI INTO EXCEL’S MACRO PROGRAMMING.pdf
- Boosting E88_RascoDT_Throughput_A Lean Approach to Machine Utilization.pdf
- CURRENT SENSOR CAPACITY IMPROVEMENT.pdf
- DIE ATTACH CHANGE IN EPOXY WEIGHT FOR CONSUMPTION REDUCTION.pdf
- Effective way of extracting weight of composite materials.pdf
- ELIMINATION OF MANUAL TEMPERATURE & RELATIVE HUMIDITY MONITORING THROUGH AUTOMATIC DATA LOGGER & REAL-TIME NOTIFICATION SYSTEM.pdf
- Enhancing Semiconductor Fabrication Through Operational Optimization and Cost-Efficiency through N2 removal strategies.pdf
- EoDT NEURAL FRAMEWORK_33rd ANTS_.pdf
- INTELLIGENT VIDEO ANALYTICS FOR IMPROVING MAN-TO-MACHINE-RATIO (MMR) IN AN ASSEMBLY LINE.pdf
- Leading Indicator Detection through SPC input Variable Controls S.Novio.pdf
- LENS GLUE DISPENSE ATTACH IMPROVEMENT THROUGH FLUID PRESSURE OPTIMIZATION TO COMPENSATE HIGHER VISCOSITY AND TO MEET REQUIRED PRODUCTION OUTPUT.pdf
- Optimizing Cost Efficiency – Product Cost Reduction for Product X BAs_MSorallo.pdf
- PREVENTION OF MOTOR AND SENSOR ASSEMBLY FAILURES FLOW-OUT BY INTRODUCING IMPROVISED TESTING EQUIPMENT.pdf
- PROCESS SIMPLIFICATION THROUGH ELIMINATION OF PRE-CUT, COVERLAY AND DE-TAPE PROCESS FOR MEMS INSTRIP PACKAGES.pdf
- REDUCTION OF CYCLE TIME THROUGH ELIMINATION OF SINK MARK BY IMPROVING THE MOLD DESIGN.pdf
- Scalable Platform Approach for Analyzing Change in Manufacturing Data.pdf
- Streamlining Quality, Efficient Process, Batch Lot Optimization Through Value Stream Mapping and Lean Sigma with Elite Inline Repair System.pdf
- SYSTEMIC APPROACH ON ROOT CAUSE ANALYSIS OF BANDGAP FAILURE FOR YIELD IMPROVEMENT OF QFN DEVICES.pdf
- THE EFFECTIVE USE OF TRIZ METHODOLOGY IN THE OPTIMIZATION OF THE TERMINAL SOLDERING PROCESS OF BALANCED ARMATURES.pdf
- TRANSFORMING PAPER-BASED WORK INSTRUCTIONS INTO ANIMATED CAD SIMULATIONS WITH AI-GENERATED CAPTIONS.pdf
- Unsupervised Change Detection for Within-Run Manufacturing Data.pdf
- VIRTUAL PARTS TRACKING USING AUGMENTED REALITY (AR) IN AN ASSEMBLY LINE.pdf
- WAFER TOP METALLIZATION ANOMALY DETECTION at 3RD OPT 3.pdf
- WIREBOND MONITORING SIMPLIFICATION AND CYCLE TIME IMPROVEMENT BY ELIMINATION OF NON-VALUE ADDED ACTIVITIES.pdf
Failure Analysis and Reliability
- A STUDY ON THE EFFECT OF BLACK SILICON DIE ON THE INFRARED IMAGING.pdf
- CHARACTERIZATION OF EPOXY GLUE ADHESION PERFORMANCE ON GOLD PLATED COPPER SUBSTRATES.pdf
- Characterization of Protective Films_Abayari Cueva Patrocenio_Manuscript.pdf
- DEEP LEARNING APPLICATION FOR AUTOMATED CLASSIFICATION OF PARTICLE MORPHOLOGY IN ROOT CAUSE ANALYSIS.pdf
- DEFINING THE DIE ATTACH SINGLE VOID CRITERIA ON A GALLIUM NITRIDE (GaN) RF POWER TRANSISTOR IN AN AIR CAVITY CERAMIC (ACC) PACKAGING.pdf
- Effective Failure Analysis Approach in Uncovering Gate-to-Drain Source Tungsten Spur Fabrication Defect.pdf
- Exploring Failure Distribution Plots for Predictive Lifetime Analysis in the Qualification of Silver Sinter Die Attach Material in Air Cavity Package.pdf
- FAULT TREE ANALYSIS OF PNP HEAD LINEAR MOVEMENT FAILURE ON X-PITCH ASSEMBLY.pdf
- FINDING THE DIE CONFIGURATION THAT CAN OVERCOME MECHANICAL ASSEMBLY STRESSES USING LABORATORY SCALE SIMULATION SET UP.pdf
- FINITE ELEMENT ANALYSIS ON WIRE BOND BREAK DURING TC AND PTC EVALUATING ENCAPSULANT MATERIAL CHANGE AS A POTENTIAL SOLUTION.pdf
- FRACTAL GEOMETRY, IMAGE ANALYSIS & THERMAL PROFILING v2.pdf
- High Precision Selective Backside Decapsulation Technique_onsemi Carmona.pdf
- Optimizing Rel Quals of Balanced Armatures – Acc Test Conditions_GSumalinog.pdf
- Pre-EMC Testing in ATC versus an EMC Test Laboratory.pdf
- Viability of Plasma Cleaning_33rd ANTS Technical Paper_rev01.pdf
Product
- Chem Selection in UV-Cured Adhesives for Drive Rod Bonding of BAs_DPatarata.pdf
- Comparative Performance Evaluation of Copper Wire Compositions_onsemi Carmona.pdf
- ETCHED TO STAMPED LEADFRAMES AS A COST-EFFECTIVE SOLUTION TO COPPER LEADFRAME SUPPLY_r2.pdf
- Harmonization of DC Thermal Resistance Settings and Limits of RF Power Transistors.pdf
- SILVER SINTER MATERIAL DISPENSE OPTIMIZATION ELIMINATION OF SINTERING VOIDS DEFECT FORMATION IN GALLIUM NITRIDE DIE ATTACH.pdf
- SILVER SINTERING DIE ATTACH GALLIUM NITRIDE DIE TECHNOLOGY PACKAGING SOLUTION AND ALTERNATIVE TO EUTECTIC GOLD-TIN (AuSn) DIE ATTACH.pdf
- STRATEGIC DEPLOYMENT OF EFFECTIVE AND EFFICIENT METHODOLOGICAL CONTROLS OF FOREIGN MATERIAL INTERFERENCE IN WAFER-LEVEL 1K MANUFACTURING CLEANROOM ENVIRONMENT.pdf
- THERMAL STABILITY ASSESSMENT OF STANDARD & REDUCED Ni(Co)-Pd-Au METALLIZATION THICKNESS ON Cu-Mo70Cu-Cu HEATSPREADERS THROUGH SURFACE CHARACTERIZATION.pdf
- WAFER RECONSTRUCTION PROCESS – A BREAKTHROUGH TECHNOLOGY SOLUTIONS EMPLOYED TO TECHNICAL DIFFUSER WAFER PREPARATORY MANUFACTURING.pdf
- WAFER SAW PROCESS CHARACTERIZATION OF GALLIUM NITRIDE (GaN) WAFER TECHNOLOGY.pdf
Quality Systems
- CHALLENGE TO ERROR PROOFING AUTOMATED INSPECTION SOLUTIONS TO EMBEDDED COSMETIC DEFECTS ON OPTICAL DIFFUSER WAFER USING HIGH RESOLUTION CHROMA EQUIPMENT.pdf
- CHALLENGING CURRENT CUSTOMER REQUIREMENT OF CHANGING PROCESS _A SIX SIGMA PROJECT REDUCTION OF IN-PROCESS DEFECT RATE IN SOLDER PASTE PRINTING PROCESS.pdf
- ELECTRONIC MEASUREMENT SYSTEM ANALYSIS.pdf
- ELIMINATION OF DAMAGE CARRIER TAPE FOR DFN8 2X2 PACKAGE IN PICKER MACHINE.pdf
- ELIMINATION OF LIFTED BALL BOND ABNROMALITY ON SQFP PACKAGE.pdf
- EMBARKING AN INTEGRAL YIELD OPTIMIZATION JOURNEY THROUGH TECHNICAL RESEARCH UNCOVERING INNOVATION AND OPPORTUNITIES AT MIT WAFER RECONSTRUCTION PROCESS.pdf
- ENHANCED AUTOMATED VISUAL INSPECTION MANAGEMENT FOR QUALITY CONTROL AUTOMATIC DEFECT CLASSIFICATION (ADC) Technical Paper Template.pdf
- ENSURING OPERATOR’S SAFETY DURING SPOTWELDING OF FRAME R 7160 THROUGH THE FABRICATION OF A WELDING JIG.pdf
- FAILURE ANALYSIS OF PICK-AND-PLACE’S BRAKE PROBLEM THROUGH MULTIFACTORIAL EXPERIMENTS.pdf
- HARD STAIN PPM REDUCTION IN POTTING STATION THROUGH EFFECTIVE AND ROBUST DESIGN OF TAPE TRACK COVER.pdf
- INNOVATION AND INCLUSION OF POU DESICCANT DRYER TECHNOLOGY TO ELIMINATE PAD DISCOLORATION CAUSED BY INTERACTION OF CDA MOISTURE TO METALLIC LGA PADS.pdf
- LEADFRAME TAPE DE-REEL PREVENTION AT WIREBOND MACHINE THROUGH SENSOR INTEGRATION.pdf
- MODEL G & H SOFTWARE MALFUNCTION RESHIP REDUCTION.pdf
- Model S Yield Improvement Through Failed Adjust Reduction.pdf
- PHONE POWER RESHIP REDUCTION FOR PHONE 3 MODEL.pdf
- PROBE DAMAGE REDUCTION USING KAIZEN METHODOLOGY.pdf
- REDUCTION OF DENTS DUE TO FLOATING SCRAP THROUGH INSTALLATION OF COUNTERBORE TYPE LOWER DIE CUTTING INSERT.pdf
- REDUCTION OF IGBT SIDE WALL CRACK.pdf
- REDUCTION OF KELVIN CHECK FAILURE OF DEVICE A AT QFN TES.pdf
- REDUCTION OF MACHINE FAILURE THROUGH ERROR PROOFING METHODOLOGY.pdf
- REDUCTION OF OVER REJECTION AT MARKING, ORIENTATION, AND PACKAGE (MOP) VISION INSPECTION OF DEVICE X.pdf
- REDUCTION_OF_NON-STICK_ON_LEAD_ON_CU_LEAD_FRAME_WITH_AG_SPOT.pdf
- Smart Manufacturing_Integrating Factory Look for Efficiency and Innovation
- Wafer Quality Prediction With Disposition Intelligence.pdf
Support Systems
- Data Analytics Through Automated Z-Score Diagnostic.pdf
- Efficient Shuttle Operations.pdf
- Natural Language Processing Enabled Natural Calamity Proactive Crisis Management.pdf
- Start-up Checklist Migration to Universal Data Collection.pdf
- Support Systems_Sustainable Water Management_A Feasibility Study_onsemi Carmona .pdf
- UNLOCKING INSIGHTS FROM MULTIMODAL DATA ADVANCED DATA ANALYTICS FOR COMPLEX DATA SOURCES AND PROCESSING.pdf
- Wafer Probe Equipment and Analog Hardware Maintenance.pdf
Test Manufacturing
- ACCELERATING TEST CAPACITY THROUGH SELECTIVE POWER REGULATION AND PULSE SETTINGS OPTIMIZATION.pdf
- ATE POWER SUPPLY DELTA AUTOMATION – THE POWER OF PREDICTING TESTER SHUTDOWNS.pdf
- BEST TOOL MATCHING METHODOLOGY.pdf
- CDSEM Automated Inspection and Defects Classification.pdf
- COUNT TRIANGULATION SYSTEM THAT SUBSTANTIATES TEST COUNT FROM TESTER, HANDLER, AND PHYSICAL UNIT VIA DATALOG, API COMMAND AND OTSR, TO TRAP UNIT MIXING IN SEMICONDUCTOR FINAL TEST MANUFACTURING.pdf
- DEVICE TEST TRACEABILITY AN ENHANCED APPROACH FOR UNIT LEVEL TRACEABILITY IN FINAL TEST.pdf
- ELEVATING EFFICIENCY- KAKAROT SUPER GUI’S JOURNEY TOWARDS ENHANCED PRODUCTIVITY.pdf
- EMPLOYING AUTOMATION OF DIRECT CURRENT RESISTANCE TESTING UTILIZING EG PROBER ON RECONSTRUCTED WAFERS FOR A COMPREHENSIVE SOLUTION OF BROKEN TRACE DETECTION AT DIE-LEVEL CIRCUITRY.pdf
- Final Test Data Checker (FTDC) A SYSTEM-BASED APPROACH ON DETECTING A POTENTIAL DEVICE MIXING ISSUE AT FINAL TEST 2 2.pdf
- MSOP Handler PPJ Improvement Using BTM Methodology.pdf
- PROBE CONTACT FORCE_ SIGNIFICANT FACTOR IN REDUCING CONTACT.pdf
- REVOLUTIONIZING MAINTENANCE EFFICIENCY – ATE SYSTEM SMART TOOL.pdf
- SMART FACTORY OPTION POST TEST SYSTEM-BASED PROCESS CONTROL (SPC) SOLUTIONS.pdf
- Test_Using Setup Parametric to Identify and Resolve Bad Sites_onsemi Carmona.pdf
- Tester Anomaly Detection with ML Prediction.pdf
SEIPI’s networking committee that continuously works on the best security professional practices, which shares a common goal amongst SEIPI members. Its vision is to provide leadership role in the design and propagation of effective security business practices and application for semiconductor and electronics industries in the Philippines.
NAME | COMPANY | NWC POSITION | |
|---|---|---|---|
Jill Mallorca | onsemi | Deputy Chair/R&D/Roadmap | |
Jonathan Francis De Jesus | Continental Temic Electronics (Phils.). Inc | ||
Wowie Makalintal | Gruppo EMS, Inc. | Chairperson/Services | |
Gloria Delfin | Ibiden Philippines Inc. | Training | |
Norman Paca | Integrated Micro-Electronics, Inc. | Services | |
Jay Chavez | Ionics EMS, Inc. | Advocacy | |
Sandeep Sinha | Maxeon Solar Technologies | R&D/Roadmap | |
John Lemuel Sevilleno | Microchip Technology Operations Corporation | Services | |
Joey Jallorina | onsemi | Networking | |
Jan Capitulo | Texas Instruments (Philippines), Inc. | Advocacy | |
Michael Ocampo | Toshiba | Advocacy | |
Reden Santos | Western Digital Philippines | Information |
Top three (3) priorities for 2024
Training
R&D
Advocacy
Information
Networking
Service
Q1
Q2
Q3
Q4
For more information, please contact marcus.tayas@seipi.org.ph
ASLM is SEIPI’s committee in charge of facilitation movement of goods, with main lobbying efforts towards simplifying procedures in the Bureau of Customs and PEZA. Its vision is to make the Philippines the benchmark country in Asia in trade facilitation. It’s mission is to enhance the global competitiveness of the industry, through the simplification of import and export rules and regulations towards the improvement of trade facilitation thereby reducing the transit and cycle time of finished goods and cost of doing business in the Philippines.
NAME | COMPANY | NWC POSITION | |
|---|---|---|---|
Arman Malgapo | Amkor Technology Philippines, Inc. | NETWORKING | |
Ariel Pablo | Analog Devices Gen. Trias Inc. | DEPUTY CHAIRPERSON | |
Melanie Quiambao | Continental Temic Electronics (Phils.). Inc | TRAINING | |
Dante Hernandez | Gruppo EMS, Inc. | ADVOCACY | |
Fherie Gonzales | Ibiden Philippines Inc. | SERVICES | |
Joy Bondo | Integrated Micro-Electronics, Inc. | INFORMATION | |
Monina Dimacuha | Ionics EMS, Inc. | TRAINING | |
Wilda Calderon | Maxeon Solar Technologies | CHAIRPESON | |
Andrea Elca | Microchip Technology Operations Corporation | ADVOCACY | |
Alvin Eusebio | onsemi | DEPUTY CHAIRPERSON | |
Marilou Ferradnos | Teradyne | SERVICES | |
Jennifer Ayson | Texas Instruments (Philippines), Inc. | R&D | |
Adornita Panganiban | Toshiba | NETWORKING | |
Darlene Gutierrez | Western Digital Philippines | INFORMATION |
The Networking Committees (NWCs) are attended by Directors/Senior Managers, Managers and Supervisors, to act as the platform for benchmarking and exchange of ideas. Through the NWCs, SEIPI organizes a wide variety of
training programs to strengthen the global competitiveness of the industry.
ASPA is the networking committee tasked in managing and policing ethical hiring practices within the industry as well as serving as a networking venue for best known labor relation practices and information source for the industry on other labor related matters. Its vision is to reinforce the transition of the organization to become strategic business partners (SBPs) of the semiconductor and electronics industry.
NAME | COMPANY | NWC POSITION | |
|---|---|---|---|
Cyras Palmos | Maxeon Solar Technologies | CHAIRPERSON | |
Jocelle Alvarez | Amkor Technology Philippines, Inc. | INFORMATION | |
Louie Pineda | Automated Technology (Phils.), Inc. | R&D | |
Mayeth Bondoy | Continental Temic Electronics (Phils.). Inc | SERVICES | |
Chie Dizon | Gruppo EMS, Inc. | ADVISER | |
Angelita Mercado | Ibiden Philippines Inc. | R&D & SERVICES | |
Lani Valle | Ionics EMS, Inc. | TRAINING | |
Ahyie Reyes | Microchip Technology Operations Corporation | ADVISER | |
Joy Roman | Teradyne | INFORMATION | |
Anne Cordero | onsemi | ADVOCACY | |
Jhonas Quiriz | Texas Instruments (Philippines), Inc. | NETWORKING | |
Eric Bien V. Anareta | Western Digital Philippines | R&D |
Training
R&D
Advocacy
Information
Networking
Service
For more information, please contact mary.tayag@seipi.org.ph
Quarterly Meetings
Q1 RMM
Q2 RMM
Q3 RMM
Q4 RMM
ASPM is the venue for sharing information among SEIPI member-companies on best procurement practices, localization of raw materials, supplier co-development and other related matters. Its objectives are: To increase purchasing effectiveness and productivity to develop the industry’s supply base and purchasing environment to increase the purchasing contribution to the employer organizations’ survival and growth; To continually develop purchasing competencies and perform above the standards of the purchasing profession.
NAME | COMPANY | NWC POSITION | |
|---|---|---|---|
Angelita Sta. Maria | Amkor Technology Philippines, Inc. | Information | |
Ria Ayson | Analog Devices Gen. Trias Inc. | Advocacy | |
Ana Marie Lagaras | Automated Technology (Phils.), Inc. | Services | |
Mary Anne Garcia | Continental Temic Electronics (Phils.). Inc | Deputy Chairperson | |
Danny Javid | Gruppo EMS, Inc. | Advocacy | |
Lorelie Mendoza | Ibiden Philippines Inc. | Training | |
Joy Bondoc | Integrated Micro-Electronics, Inc. | Advocacy | |
Perly Lazo | Ionics EMS, Inc. | R&D/Roadmap | |
Madel Valdez | Maxeon Solar Technologies | Advocacy | |
April Joy Cruza | Microchip Technology Operations Corporation | Services | |
Reynaldo Taghoy | Minebea Mitsumi (Cebu Mitsumi) | Networking | |
Daisy Umayam | onsemi | Training | |
Eric Santos | ST Microelectronics | Information | |
Ingrid Aloba | Teradyne – Cebu | ||
Rose Siobal | Texas Instruments (Philippines), Inc. | Advocacy | |
Beverly Rosario | Toshiba | Advocacy | |
Elizabeth Dela Rosa | Western Digital Philippines | ||
Raymond Chua | MEPZ Mixed Gases Corp. | Chairperson/VisMin Chairman |